活动简介

EMC+SIPI 2021 leads the industry in providing state-of-the-art education on EMC and Signal Integrity and Power Integrity techniques. The Symposium features five full days of innovative sessions, interactive workshops/tutorials, experiments and demonstrations, and social networking events.

Sponsor Type:1

组委会

GENERAL CHAIR

Bruce Archambeault

CO-VICE-CHAIRS

Steven Scearce
John LaSalle

SECRETARY

Ed Bodette

TREASURER/FINANCE CHAIR

Bob Davis

TECHNICAL PROGRAM CHAIR

Sam Connor

TECHNICAL PAPERS CHAIR

Zhiping Yang

GLOBAL UNIVERSITY CHAIR

Lee Hill

SPECIAL SESSIONS CO-CHAIRS

Colin Brench
Luanne Miekodaj

WORKSHOPS/TUTORIALS CO-CHAIRS

Vignesh Rajamani
Jacob Dixon

EXPERIMENTS & DEMONSTRATIONS CO-CHAIRS

Bob Scully
Jay Diepenbrock

EXHIBITS CHAIR

Rich Spangenberg

REGISTRATION CHAIR

Beth Scully

PUBLICATIONS CHAIR

John Rohrbaugh

ARRANGEMENTS CO-CHAIRS

Rhonda Rodriguez
Dale Stone

COMPANION CHAIR

Judy Rohrbaugh

VOLUNTEER COORDINATOR CHAIR

Alpesh Bhobe

YOUTH TECHNICAL PROGRAM CHAIR

Kevin

CONFERENCE MANAGEMENT

John Vanella

WEBSITE/MARKETING

Kelly Scott-Olson

征稿信息

重要日期

2020-10-19
初稿截稿日期

征稿范围

The IEEE EMC Society’s Technical and Special Committees encompass most but not all of the possible topics of interest. These Committees are responsible for sponsoring Symposium content and reviewing papers within their scope. The Committees, their scopes, and their primary topics of interest are listed below:

TC-1 EMC Management

Personnel & Laboratory Accreditation
EMC Education
Legal Issues

TC-2 EMC Measurements

Test Instrumentation & Facilities
Measurement Techniques
Standards and Regulations

TC-3 EM Environment

EM Signal Environment
Atmospheric & Man-Made Noise

TC-4 EM Interference Control

Shielding, Gasketing & Filtering
Cables and Connectors
Circuit & System EMC Analysis
Grounding

TC-5 High Power Electromagnetics

ESD & Transients
EMP, IEMI & Lightning
Information Leakage
Electric Power EMC

TC-6 Spectrum Engineering

Spectrum characterization and modeling
Design for spectrally efficient systems
Adaptive interference mitigation

TC-7 Low Frequency EMC

Power Quality and Power System EMC
Conducted Emissions due to Power Converters
Transportation and Electric Vehicles
Renewables and Smart Grid

TC-8 Aeronautics and Space EMC

Aircraft
Atmospheric environment
Drones
Spacecraft
Space environment
Launch vehicles
Missiles

TC-9 Computational Electromagnetics

Computer Modeling Methods
Tools and Techniques
Validation Methods
Statistical Analysis

TC-10 Signal and Power Integrity

High-Speed Interconnects
Device Modeling & Characterization
Crosstalk, Jitter, Noise Coupling, BER Analysis
3D IC & TSV
Power Distribution Networks & Decoupling
SI/PI/EMI Co-Design
Simulation and Modeling Techniques
Chip-level advanced packaging

TC-11 Nanotechnology & Advanced Materials

Nanomaterials & Nanostructures
Smart Materials

TC-12 EMC for Emerging Wireless Technologies

EMC Planning/Testing/Specifications
Wireless Coexistence
Intra-System Interference
RF desense

SC-1 Smart Grid EMC

RF Environment
Performance Degradation

SC-5 Power Electronics EMC

Power electronics converters EMI/EMC issues
Switching frequency schemes
Inverters
Grid-connected PV systems, wind farms
Automotive, aerospace, and communication systems.

SDECom Standards Development

Standards development
Status of or work in support of standards in development
Critical updates or issues for published standards
Topics for future standardization

作者指南

The IEEE EMC Society is seeking original, unpublished papers covering all aspects of electromagnetic compatibility, signal integrity and power integrity including design, modeling, measurements, management and education.

Conference proceedings will be submitted for posting to IEEE Xplore. In addition, authors of high-quality, accepted papers will be invited to submit an extended version of their symposium paper for possible publication in a special issue of the IEEE Transactions on Electromagnetic Compatibility. These submissions will be subjected to the same rigorous review as papers submitted for publication in regular issues of the IEEE Transactions on EMC.

Abstract authors will be invited to submit a full-length paper (up to 8 pages) for publication in the IEEE Letters on Electromagnetic Compatibility Practice and Applications (LEMCPA), which contains substantial additional technical material compared to the one-page abstract published in the symposium proceedings. Together with the invitation the authors get review comments and feedback from the discussion provided by the session chair.

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重要日期
  • 会议日期

    05月03日

    2021

    05月07日

    2021

  • 10月19日 2020

    初稿截稿日期

  • 05月07日 2021

    注册截止日期

主办单位
IEEE Electromagnetic Compatibility Society
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