EMC+SIPI 2021 leads the industry in providing state-of-the-art education on EMC and Signal Integrity and Power Integrity techniques. The Symposium features five full days of innovative sessions, interactive workshops/tutorials, experiments and demonstrations, and social networking events.
Sponsor Type:1
GENERAL CHAIR
Bruce Archambeault
CO-VICE-CHAIRS
Steven Scearce
John LaSalle
SECRETARY
Ed Bodette
TREASURER/FINANCE CHAIR
Bob Davis
TECHNICAL PROGRAM CHAIR
Sam Connor
TECHNICAL PAPERS CHAIR
Zhiping Yang
GLOBAL UNIVERSITY CHAIR
Lee Hill
SPECIAL SESSIONS CO-CHAIRS
Colin Brench
Luanne Miekodaj
WORKSHOPS/TUTORIALS CO-CHAIRS
Vignesh Rajamani
Jacob Dixon
EXPERIMENTS & DEMONSTRATIONS CO-CHAIRS
Bob Scully
Jay Diepenbrock
EXHIBITS CHAIR
Rich Spangenberg
REGISTRATION CHAIR
Beth Scully
PUBLICATIONS CHAIR
John Rohrbaugh
ARRANGEMENTS CO-CHAIRS
Rhonda Rodriguez
Dale Stone
COMPANION CHAIR
Judy Rohrbaugh
VOLUNTEER COORDINATOR CHAIR
Alpesh Bhobe
YOUTH TECHNICAL PROGRAM CHAIR
Kevin
CONFERENCE MANAGEMENT
John Vanella
WEBSITE/MARKETING
Kelly Scott-Olson
The IEEE EMC Society’s Technical and Special Committees encompass most but not all of the possible topics of interest. These Committees are responsible for sponsoring Symposium content and reviewing papers within their scope. The Committees, their scopes, and their primary topics of interest are listed below:
TC-1 EMC Management
Personnel & Laboratory Accreditation
EMC Education
Legal Issues
TC-2 EMC Measurements
Test Instrumentation & Facilities
Measurement Techniques
Standards and Regulations
TC-3 EM Environment
EM Signal Environment
Atmospheric & Man-Made Noise
TC-4 EM Interference Control
Shielding, Gasketing & Filtering
Cables and Connectors
Circuit & System EMC Analysis
Grounding
TC-5 High Power Electromagnetics
ESD & Transients
EMP, IEMI & Lightning
Information Leakage
Electric Power EMC
TC-6 Spectrum Engineering
Spectrum characterization and modeling
Design for spectrally efficient systems
Adaptive interference mitigation
TC-7 Low Frequency EMC
Power Quality and Power System EMC
Conducted Emissions due to Power Converters
Transportation and Electric Vehicles
Renewables and Smart Grid
TC-8 Aeronautics and Space EMC
Aircraft
Atmospheric environment
Drones
Spacecraft
Space environment
Launch vehicles
Missiles
TC-9 Computational Electromagnetics
Computer Modeling Methods
Tools and Techniques
Validation Methods
Statistical Analysis
TC-10 Signal and Power Integrity
High-Speed Interconnects
Device Modeling & Characterization
Crosstalk, Jitter, Noise Coupling, BER Analysis
3D IC & TSV
Power Distribution Networks & Decoupling
SI/PI/EMI Co-Design
Simulation and Modeling Techniques
Chip-level advanced packaging
TC-11 Nanotechnology & Advanced Materials
Nanomaterials & Nanostructures
Smart Materials
TC-12 EMC for Emerging Wireless Technologies
EMC Planning/Testing/Specifications
Wireless Coexistence
Intra-System Interference
RF desense
SC-1 Smart Grid EMC
RF Environment
Performance Degradation
SC-5 Power Electronics EMC
Power electronics converters EMI/EMC issues
Switching frequency schemes
Inverters
Grid-connected PV systems, wind farms
Automotive, aerospace, and communication systems.
SDECom Standards Development
Standards development
Status of or work in support of standards in development
Critical updates or issues for published standards
Topics for future standardization
The IEEE EMC Society is seeking original, unpublished papers covering all aspects of electromagnetic compatibility, signal integrity and power integrity including design, modeling, measurements, management and education.
Conference proceedings will be submitted for posting to IEEE Xplore. In addition, authors of high-quality, accepted papers will be invited to submit an extended version of their symposium paper for possible publication in a special issue of the IEEE Transactions on Electromagnetic Compatibility. These submissions will be subjected to the same rigorous review as papers submitted for publication in regular issues of the IEEE Transactions on EMC.
Abstract authors will be invited to submit a full-length paper (up to 8 pages) for publication in the IEEE Letters on Electromagnetic Compatibility Practice and Applications (LEMCPA), which contains substantial additional technical material compared to the one-page abstract published in the symposium proceedings. Together with the invitation the authors get review comments and feedback from the discussion provided by the session chair.
05月03日
2021
05月07日
2021
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