活动简介

The Smart Systems Integration Conference and Exhibition goes virtual in 2021. We invite you to present your recent developments in the field of Smart Systems along the whole of the value chain, starting from MEMS/NEMS, photonics, micromechanics, microfluidics, printed functionalities through to complete systems and different application scenarios.

Sponsor Type:1; 9

组委会

Conference Chairs

Prof. Thomas Otto
Fraunhofer ENAS

Stefan Finkbeiner
Bosch Sensortec GmbH/EPoSS Chairman

Emmanuel Sabonnadiere
CEA LETI
 

征稿信息

重要日期

2020-12-13
摘要截稿日期
2021-01-29
初稿截稿日期

征稿范围

Track 1 Key Enablers for Next Generation Smart Systems 

New discoveries & inventions of functional principles for Smart Systems and artificial intelligence at the edge & in the cloud:

▪ Novel concepts for smart sensing, actuation, energy supply, data processing, storage, AI and communication
▪ Design & design verification methods for Smart Systems
▪ Material innovations, new fabrication tools & processes
▪ Advanced micro / nano and smart power technologies
▪ Heterogeneous integration for Smart Systems with AI
▪ Methodologies and concepts for reliability, safety, and security to be inherently built into components and systems

Track 2 Key Technologies for Smart Systems

Hardware and software building blocks of Smart Systems, their design, fabrication, and test methods at device, wafer, component, module, and system levels:

▪ System Integration
▪ Embedded intelligence and cognition at the device level
▪ Fabrication of micro/nano systems & smart power systems
▪ Smart low-cost approaches including roll-to-roll technologies and printed functionalities
▪ High volume components at Euro cents for billions of infection or immunity tests

Track 3 Application Domains: Mobility, Energy, Industry

AI based smart sensor systems and networks, control units and drives incl. aspects such as power electronics, packaging and further system integration as well as communication systems for the fields of (auto)mobility, energy, and automation like:

▪ E-mobility (land, air and sea) and its infrastructure
▪ Highly automated and connected vehicles
▪ Secure, reliable, decentralized, multi-modal energy systems with a high level of renewable sources
▪ Highly automated distribution grids coupling the energy sector with mobility, industry & domestic use
▪ Ultra-flexible, high-performing, energy and resource efficient, and collaborative production facilities
▪ Digital twins supporting from design to customer service

Track 4 Application Domains: Food, Biomedical, Healthy Living

Disruptive innovation of Smart Systems in terms of accuracy, autonomy, automation, cost, size, etc. for applications like

▪ Digitising agriculture for sustainable production
▪ Food safety, security, and monitoring from field to fork
▪ Inexpensive real-time disease detection, e.g. COVID-19
▪ Connected life - Enabling the work-life balance
▪ Combined wearable / implants systems
▪ Enabling healthy lifestyles to prevent disease and to promote autonomous living

Track 5 Strategy and Business Creation

Instruments of support addressing aspects of strategy and business creation:

▪ Global market dynamics and the stability of value chains
▪ The competitive advantages of European ecosystems
▪ Political framework and support programmes
▪ From research to business: start-up and SME support
▪ Global co-operation and Joint venture strategies
▪ Opportunities and challenges of networking at European and regional level
▪ Standardisation
▪ Highlights from digital innovation hubs in action

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重要日期
  • 会议日期

    04月27日

    2021

    04月29日

    2021

  • 12月13日 2020

    摘要截稿日期

  • 01月29日 2021

    初稿截稿日期

  • 04月29日 2021

    注册截止日期

主办单位
Fraunhofer Gesellschaft e.V. IEEE Electronics Packaging Society
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