Huaidong Min*
Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials
Xinsheng Zhang*
Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials
Yizhe Liu, Xiaoping Dai, Xi Jiang*, Fang Qi, Yang Liu, Pan Ke, Yongzhi Wang, Jun Wang, Zhong Zeng
Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials
Bo Hu, Zishun Peng, Pei Xiao, Yuxing Dai, Chao Zhang, Jun Wang*
Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials
Kun Qu, Chao Zhang*, Xin Yin, Jun Wang, Weibin Chen, Bo Hu
Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials
Shuaige Zhu, Haiyan Zhu, Qihui Fu, Yuxing Dai, Jun Wang*, Ling Ou, Pei Xiao, Zishun Peng
Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials
Chengfei Geng, Donglai Zhang*, Xuanqin Wu, Wen Shen, Ruiyong Dong
Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration and materials
11月02日
2020
11月04日
2020
初稿截稿日期
报告提交截止日期
注册截止日期
终稿截稿日期
2024年11月06日 中国 Wuhan
China International Youth Conference on Electrical Engineering (CIYCEE 2024)2023年12月08日 中国 Chengdu
4th China International Youth Conference on Electrical Engineering2023年07月11日 中国 Chengdu
2nd China International Youth Conference on Electrical Engineering2022年11月03日 中国 Wuhan
2022 IEEE 3rd China International Youth Conference on Electrical Engineering