2 / 2020-05-09 21:06:52

Semiconductor device testing

Testing, device

This paper contains the detail explanation of how the semiconductor device testing was done and about the tester and its modules.
Before shipping the wafers or components back to the customers or to the supply chain they must be verified that no damage on the material to test the wafer you need a wafer prober automatic test equipment a probe card and a customized test program after loading the test program the wafer lot is placed in the wafer prober and programmatically selects one wafer at a time for testing the wafer. With the vacuum an advanced positioning system helps to move the chunk around in a rapid and very accurate pattern below the probe card in order to test every single device on the wafer and the tester generates a wafer map which shows which devices are good and which are bad this information is used later in the supply chain when the wafers are being further processed wafers intended for encapsulation are sent to partners after encapsulation they are returned for component testing to test components. For that process you need a component handler automatic test equipment a customized load board and a customized test program once the test program loaded the components are placed in handler the handler ensures that the device under test is moved to the correct position on load board the output of test is a separation of good and bad components in order to protect wafers and components from humidity and electrostatic discharge they are sealed under vacuum in anti-static bags after testing the wafers or components they are inspected once more before packaging and shipping to the customer.