活动简介

Second IEEE International conference on Electronics, Communication and Aerospace Technology (ICECA 2018) is being organized on 29,30,31 March 2018 by RVS Technical Campus.Second ICECA 2018 will provide an outstanding international forum for scientists from all over the world to share ideas and achievements in the theory and practice of all areas of aero space technologies. Presentations should highlight inventive systems as a concept that combines theoretical research and applications in Electronics, Communication, Information and Aerospace technologies.

征稿信息

重要日期

2017-10-01
摘要截稿日期
2018-02-15
初稿截稿日期
2018-03-07
初稿录用日期
2018-03-15
终稿截稿日期

Original and high quality research papers are solicited in all areas of Electronics, Communication and Aerospace Systems.

征稿范围

Informatics

  • Coding Techniques for 3G & 4G
  • UWB Systems
  • Digital Multimedia Systems
  • Airborne Vehicle Communication
  • Antenna Systems
  • Signal & Image Processing
  • Telemetry & Tele command Systems
  • Optical Communication
  • Satellite Technology
  • Earth Station Systems & Technology
  • Wireless Networks
  • Spectrum Management
  • Cognitive Radio Design
  • Millimeter Wave Technology
  • Telecom Management
  • Underwater Communication
  • Biomedical Signal Processing
  • Wavelets & Applications
  • Multi Carrier Modulation
  • MIMO Systems
  • Microwave Systems
  • Electromagnetics Engineering
  • Bio-computation Techniques
  • Cryptography
  • Switching
  • IOT
  • Big Data
  • Cloud Computing
  • Health care Informatics



Data Communication and Computer Networking

  • Cryptography
  • High Speed Networks
  • Mobile Computing
  • Mobile Networks & Wireless LAN
  • Optical Networking
  • Network Based Applications
  • Network Security
  • Next Generation Web
  • Recent Trends in Computer Networks
  • Wireless and Adhoc Network
  • Wireless Multimedia systems



Aerospace Technologies

  • Aerospace electronics
  • Avionics
  • Power systems
  • Electric/electronic components and distributors
  • Electric systems
  • Propulsion systems
  • Safety systems
  • Space systems
  • Unmanned aerial vehicle systems
  • Prognostics/diagnostics

Electronics Technologies

  • 3D Process and Integration Technologies
  • Substrate Embedding & Advanced Flip-Chip Packaging
  • MEMS & Sensor Technologies
  • Wafer-Level CSP & Heterogeneous Integration
  • Design and Analysis of Power Delivery Systems
  • Novel Materials, Devices and 3D Interconnects
  • Wearable, Flexible, and Stretchable Electronics
  • Optical Interconnects & 3D Photonics
  • Digital System and Logic Design
  • Computer Architecture and VLSI
  • Networked-Driven Multicore Chips
  • Advance Robotics systems
  • Electrical Machines
  • Analog and Digital Electronics
  • Signals and Systems

Communication technologies

  • Wireless Networks
  • MIMO Systems
  • Microwave Engineering
  • Wireless Security
  • Computer networks
  • IOT and Cloud Computing
  • Artificial Intelligence / Semantic Web & Ontology
  • Grid Computing / Cloud Computing
  • High Performance Computing & Networks
  • Fuzzy Systems & Soft Computing
  • Computational methods, Algorithms & Scientific Applications
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重要日期
  • 会议日期

    03月29日

    2018

    03月31日

    2018

  • 10月01日 2017

    摘要截稿日期

  • 02月15日 2018

    初稿截稿日期

  • 03月07日 2018

    初稿录用通知日期

  • 03月15日 2018

    终稿截稿日期

  • 03月31日 2018

    注册截止日期

主办单位
IEEE
协办单位
Madras Section ED Chapter
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