WELCOMETO BEI-UHPC

BEI-UHPC, an official symposium of the Bridge Engineering Institute (BEI), is a forum for international researchers and practitioners around the world. State-of-the-art knowledge on Ultra-High Performance Concrete (UHPC) and emerging concrete technologies will be discussed with distinguished speakers in plenary and parallel sessions.

CONFERENCE THEMES

The main theme of BEI-UHPC is Advances in Concrete Engineering, which will be composed of plenary lectures, parallel sessions, and exhibitions concerning UHPC and emerging concrete.

IMPORTANT DATES

Abstract submission: by Oct. 31, 2019 
(If one submits abstracts by Aug. 31, a ticket for the Garden by the Bays ($28) will be provided for free, upon registration)

Acceptance of Abstracts: by Nov. 15, 2019

Manuscript submission: by Feb. 1, 2020

Revision of manuscripts: by Mar. 1, 2020

Acceptance of Manuscripts: by Mar. 15, 2020

REGISTRATION

Full registration (BEI Members): US$650 on or before Mar. 30, 2020; US$800 after April 1, 2020

Full registration (Non-members): US$800 on or before Mar. 30, 2020; US$1,000 after April 1, 2020

Student registration: US$500 on or before Mar. 30, 2020; US650 after April 1, 2020

Accompanying person: US$300

BECOMING A SPONSOR

BEI-UHPC is one of the major conferences in concrete engineering. Your company will have a great opportunity to communicate with leading engineers and owners as well as with conference delegates. Spaces for exhibition will be provided for you to promote products and services concerning the technical specialties of your company. Social events of the conference will be another exciting chance to attract the participants of the symposium. Your support will be officially acknowledged whenever available during the course of the symposium, which will maximize the visibility of your company. For further information and sponsorship, please contact the organizers of the symposium (email: bei_institute@outlook.com).

SYMPOSIUM CHAIR

Yail Jimmy Kim (USA)

CONFERENCE SECRETARIAT

Yongcheng Ji

Email: 
bei_institute@outlook.com