The 8th IEEE International Symposium on Next-Generation Electronics (ISNE 2019) will be held at Zhengzhou, China on Oct. 09th to 10th, 2019. Based on the successful experiences on past ISNEs, the ISNE 2019 will continuously provide a platform for experts, scholars and researchers from all over the world to convene and share novel ideas on next-generation electronics.
The ISNE 2019 will feature plenary and invited talks by famous scientists in Microelectronic Devices and Materials, Microelectronic Circuits and Systems, Compound Semiconductor Materials, Electronic and Photonic Devices, Computer and Communication Engineering, Renewable and Sustainable Energy Device and Materials, Sensors, Packaging technologies, and Novel Applications in Science and Technology, Biomedical Electronics, and Advanced IC optoelectronic and MEMS Technologies.
The ISNE 2019 is supported by IEEE Electron Devices Society and IEEE. All accepted papers will be published in IEEE Xplore with Engineering Index (EI).
General Chair: 刘俊杰 周清雷
TPC CHAIR: 孙晓红 刘玉怀
Publication chair:薛琦
Microelectronic Devices and Materials
Silicon Integrated Circuits Technologies
Advance Memories Technology (Flash, FeRAM, PCM,RRAM, MRAM etc.)
Sensors and MEMS
Organic Semiconductor Devices and Technologies
Silicon Photonics
Nano-Electronic and Nano-Photonic Devices
Physics and Simulation of Optoelectronic Devices
Compound Semiconductor Materials, and Optoelectronic Devices
Compound Semiconductor Materials, Devices and Technologies
Optical Devices and Modules
Optical Communication
Fiber Optics and Fiber Sensing
Optical Thin Films
Laser Optics
Nano-Electronic and Nano-Photonic Devices
Physics and Simulation of Optoelectronic Devices
Renewable and Sustainable Energy Device and Materials
Solid State Lighting and Displays
Organic, Inorganic, and Hybrid Photovoltaics
Nano-Electronic and Nano-Photonic Devices
Energy Harvesting and Transferring Mechanisms
Enabling Materials and Fabrication
Transparent and Flexible Optoelectronics
Renewable energy electronics
Integrated Circuits and Systems
Analog and Mixed-Signal Circuits and Systems
Wireline and Wireless Communication Circuits and Systems
Data Converters
Power Management and Converters
Sensors and Actuators
Embedded Systems, Multi/Many Core Systems & Embedded Memory Technologies
Reconfigurable and Programmable Circuits and Systems
System Level Design Methodology and Tools
Design for Testability and Manufacturability
Design Verification
Bioelectronics
Processing/Devices/Circuits Modeling and Simulation
Nano-Electronic and Nano-Photonic Devices
Biomaterials
Biomedical Devices
MEMS & NEMS
Sensors and Actuators
Bioimages
Bio Circuits and Systems
Sensors, Packaging Technologies, and Novel Applications in Science and Technology
Sensor and Photodetectors
Sensors and MEMS, Fiber Optics and Fiber Sensing
Reliability, Packaging and Testing Technologies, Sensors and Photodetectors
Package Technology
Sensor Application in Science and Technology
Sensors & Actuators
Sensors Materials
Sensors Technology
RF and Microwave Circuits
RF circuits
Microwave Circuits
Millimeter Wave Techniques
Antenna
Electromagnetic Waves
EMC & EMI
Computer Communication and Multimedia Techniques
Computer Networks
Software Defined Network (SDN)/Network Function Virtualization (NFV)
Internet Applications
Communication Protocols
5G Architecture and Communications
Multimedia Systems and Applications
Embedded Systems and Applications
Mobile Computing
Video/Audio Signal Processing
Digital Signal Processing
AR/VR technique
Computer Vision
Computer Graphics
IOT and AI Techniques
Internet of Things
Internet of Vehicle
Artificial Intelligence
Machine Learning
Deep Learning
Cloud Computing
Big Data
Power and Control Engineering
Power Systems
Power Electronics
Motor Control
Remote Monitoring and Control
Home Automation
Intelligent Transportation Systems
Automotive Electronics
Novel Applications in Electrical Engineering and Photonic Devices
Others
10月09日
2019
10月10日
2019
初稿截稿日期
注册截止日期
2022年10月22日 中国 Wuxi
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2016年第五届国际下一代电子研讨会2014年05月07日 台湾-中国
2014下一代电子国际研讨会
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