AMEE 2018 will be held in Beijing, China, from December 26-28, 2018. The conference will serve as an international forum for the presentation and exchange of technological advances and research results in the broad fields of Advanced Mechanical and Electrical Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. We warmly welcome prospective authors to submit research papers to AMEE 2018, and share your latest research results and valuable experiences with other top-scientists, engineers and scholars from all over the world.
Advisory Chair:
Xiaoqing Wen, Kyushu Institute of Technology, Japan (IEEE Fellow)
Conference Chairs:
Bin Zi, Hefei University of Technology, China
Huafeng Ding, China University of Geosciences
Haitao Liu, Tianjin University, China
Program Chairs:
Toshihisa Funabashi, University of the Ryukyus, Japan
Beom Hee Lee, Seoul National University, South Korea (Fellow of IEEE & ICROS)
Technical Committee:
Huang Weimin, NTU, Singapore
Man Yongkui, Northeastern University, China
Mona N. Eskander, Electronics Research Institute(ERI), Egypt
Shengwei Yu, Purdue University, USA
Hugo Miguel Silva, University of Minho Guimarães, Portugal
Haldun M. Ozaktas, Bilkent University, Turkey
Nouby Ghazaly, South valley University, Egypt
Shuquan Wang, Chinese Academy of Sciences, China
Yifei Chen, China Agriculture University, China
Ying Chih Lai, Feng Chia University, Taiwan
Yousef Moh. Abueejela, College of Electronic Technology, Libya
Nopparat Seemuang, King Mongkut's University of Technology North Bangkok, Thailand
The accepted papers will be published in Conferences Proceedings with ISSN, which is indexed by Ei Compendex, Inspec, DOAJ, CPCI (Web of Science) and Scopus.
Submit Full Papers and accepted full papers will be presented onsite and published in the conference proceedings.
Submit abstracts and the accepted abstracts will be presented onsite but will not be published.
12月26日
2018
12月28日
2018
初稿截稿日期
注册截止日期
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