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活动简介

AMEE 2018 will be held in Beijing, China, from December 26-28, 2018. The conference will serve as an international forum for the presentation and exchange of technological advances and research results in the broad fields of Advanced Mechanical and Electrical Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. We warmly welcome prospective authors to submit research papers to AMEE 2018, and share your latest research results and valuable experiences with other top-scientists, engineers and scholars from all over the world.

组委会

Advisory Chair:

 

Xiaoqing Wen, Kyushu Institute of Technology, Japan (IEEE Fellow)

 

Conference Chairs:

 

Bin Zi, Hefei University of Technology, China

Huafeng Ding, China University of Geosciences 

Haitao Liu, Tianjin University, China

 

Program Chairs:

 

Toshihisa Funabashi, University of the Ryukyus, Japan 

Beom Hee Lee, Seoul National University, South Korea (Fellow of IEEE & ICROS)

 

Technical Committee:

 

Huang Weimin, NTU, Singapore

Man Yongkui, Northeastern University, China

Mona N. Eskander, Electronics Research Institute(ERI), Egypt

Shengwei Yu, Purdue University, USA

Hugo Miguel Silva, University of Minho Guimarães, Portugal

Haldun M. Ozaktas, Bilkent University, Turkey

Nouby Ghazaly, South valley University, Egypt

Shuquan Wang, Chinese Academy of Sciences, China 

Yifei Chen, China Agriculture University, China

Ying Chih Lai, Feng Chia University, Taiwan

Yousef Moh. Abueejela, College of Electronic Technology, Libya

Nopparat Seemuang, King Mongkut's University of Technology North Bangkok, Thailand

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重要日期
  • 会议日期

    12月26日

    2018

    12月28日

    2018

  • 10月15日 2018

    初稿截稿日期

  • 12月28日 2018

    注册截止日期

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