活动简介
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.
组委会
|
General Chairs: |
|
|
Technical Chairs: |
Conference Secretaries: |
|
International Scientific Advisory Committee: |
Local Organizing Committee: |
征稿信息
重要日期
Please send your 500+ word abstract electronically IMMEDIATELY, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full papers are due APRIL 17 and will be sent submitted separately via email or upload. All papers will be presented and published in English.
If you are having problems with the on-line submittal form, please email Brian Schieman bschieman@imaps.org.
征稿范围
1. Functional materials for passive/active devices and their properties
• Microwave/mm-wave LTCC/ULTCC dielectric materials
• Ferroelectric/piezoelectric/pyroelectric/ferrite/multiferroic materials
• Sensitive ceramics/thermoelectric/electrocaloric materials
• Dielectric/ferroelectric/piezoelectric composites
• Pastes/inks/slurries for electronics
2. Material processing and device manufacturing technologies
• LTCC/HTCC and multilayer ceramic and glass processing
• Emerging ultralow temperature, room temperature processing, and cold sintering processing
• Additive manufacturing /3D printing/ direct writing
• Advanced thick film processing
• Fine structuring technologies
• Emerging embedding/integration technologies
3. Devices for emerging technologies
• Circuits, antennas, and filters for MHz, GHz and THz for communications
• Automotive/aerospace/medical electronics/optoelectronics
• Flexible/wearable electronics
• Integrated physical/chemical/biological sensors and actuators
• Packaging and integration issues for MEMS and BioMEMS devices
• Batteries/fuel cells/ energy conversion systems
• Micro-reactors/micro-fluidic devices
4. Design, modeling, simulation, characterization and reliability
• Metamaterials design, realization and characterization
• High frequency devices design/modeling/simulation
• Materials and devices characterization
• Material and device reliability, lifetime, and failure estimation
• Thermal management/thermal transfer simulation
全部留言
重要日期
-
会议日期
05月10日
2019
至05月17日
2019
-
11月30日 2018
摘要截稿日期
-
01月31日 2019
摘要录用通知日期
-
04月17日 2019
初稿录用通知日期
-
05月17日 2019
注册截止日期
留言