征稿已开启

查看我的稿件

注册已开启

查看我的门票

已截止
活动简介

It is our great honor to welcome you to the 2019 International Conference on High Performance Big Data and Intelligent Systems (HPBD&IS 2019). HPBD&IS provides a premier venue for the presentation and discussion of research in the design, development, deployment and evaluation of high performance computing, big data and artificial intelligence. HPBD&IS brings together stakeholders from academic and industrial perspectives along with end users to explore how to utilize technologies to offer an enhanced Intelligent life. We invites participants to present and discuss their experiences in design, development, deployment and evaluation. The conference features a dynamic program incorporating a range of technical and industrial related keynote speakers, oral and poster presentations along with demonstrations and technical exhibits. We warmly invite you, scientist, engineer or technician, graduate student, or simply interested by the technique, to take part in this unique and innovative conference with your enthusiasm to develop, your desire to apply and your willingness to mature the High Performance, Big Data and Artificial Intelligence technique and their applications. 

组委会

General Chair: 

Prof. Xian-He Sun, IEEE Fellow, Illinois Institute of Technology.

 

Program Chair: 

Prof. Cheng-Zhong Xu, IEEE Fellow, Chair of Technical Committee on Distributed Processing (TCDP) of IEEE Computer Society, Shenzhen Institutes of Advanced Technology Chinese Academy of Sciences.

Prof. Weijun Li, Institute of Semiconductors Chinese Academy of Sciences, Shenzhen DAPU Microelectronics Co., Ltd.

 

Local Organizing Chair: 

Minggao Ma, Vice chairman, Shenzhen Longgang District CPPCC.

Xiang Li, President, Shenzhen International Robot City Industrial Park, Shenzhen Longgang District Robot association.

 

Industry Forum Chair:

Dr. Yafei Yang, CEO, Shenzhen DAPU Microelectronics Co., Ltd.

 

Steering Commitee:

Prof. Qing Yang, IEEE Fellow, University of Rhode Island, Shenzhen DAPU Microelectronics Co., Ltd.

Prof. Xian-He Sun, IEEE Fellow, Illinois Institute of Technology.

Prof. Cheng-Zhong Xu, IEEE Fellow, Chair of Technical Committee on Distributed Processing (TCDP) of IEEE Computer Society, Shenzhen Institutes of Advanced Technology Chinese Academy of Sciences.

Prof. Weijun Li, Institute of Semiconductors Chinese Academy of Sciences, Shenzhen DAPU Microelectronics Co., Ltd.

Prof. Haibo He, IEEE Fellow, Editor-in-Chief for IEEE Trans. on Neural Networks and Learning Systems, University of Rhode Island.

Prof. Yuan Xie, IEEE Fellow, Editor-in-Chief for ACM Journal on Emerging Technologies in Computing Systems(JETC), University of California, Santa Barbara.

Prof. Hong Jiang, IEEE Fellow, University of Texas, Arlington.

征稿信息

重要日期

2018-11-15
摘要截稿日期
2018-11-20
摘要录用日期
2018-12-15
初稿截稿日期
2019-02-01
初稿录用日期

Papers are being invited for the 2019 International Conference on High Performance Big Data and Intelligent Systems to be held in Shenzhen, China.

Submission of Abstracts and Full Papers

A one-page abstract with a title, the name and affiliation of each author and keywords should be submitted no later than November 15, 2018. Submissions received after this date will not be given primary consideration for inclusion in the program. Once your abstract has been accepted, please submit the full paper before the deadline ofDecember 15, 2018. All papers, both invited and contributed, will be reviewed by three experts. After a careful reviewing process, all accepted papers will be published in the conference proceedings of HPBD&IS 2019. The proceedings will be published by IEEE Press, and indexed by EI. Please prepare your abstract and full paper according to the attached format and preferred template.

Schedule of Events: 

By November 20, 2018, the first author and/or the corresponding author of each submitted abstract will be advised whether or not their abstract has been accepted for either a poster or an oral presentation.

Awards:

The Academic Committee will invite a number of young researchers who are the authors of certain selected abstracts to give oral presentations. These presentations will be recognized for special awards. At the close of the conference the Academic Committee will also give out a series of awards for the most outstanding poster presentations.

Language:  

The official language of the conference is English. 

征稿范围

The guiding theme of the conference will be:

1.High Performance Computing Technology and Its Application

High Performance Computer Architecture

High Performance Computer System Software

High Performance Computing Environments

High Performance Micro Processor

High Performance Storage Technology

Multi-Core and Multi-Threaded Architecture Methods

Architecture, Software and Algorithm of Parallel and Distributed System 

High Performance Ubiquitous Computing

High Performance Adaptive and Evolutionary Computing

High Performance Application

Parallel Processing of Big Data

 

2.Big Data Technology and Its Application

Big Data Model, Processing Algorithm and Programming Technology

Representation of Multimedia Big Data

Big Data Analytics and Metrics

Big Data Durability and Storage

Big Data Quality and Source Control

Big Data Protection Integrity and Privacy

Big Data Storage and Computing Fusion Technology

Big Data Search and Mining

Big Data Visual Analysis

Big Data Business Model Innovation

Big Data Security Application

 

3.Intelligent System

Neural Network and Learning System

Computer Vision

Machine Art

Robot Science and Control Engineering

Smart Sensor and Sensor Fusion

Intelligent Storage Device and System

Real Time Surveillance

Adaptive Surveillance System

Virtual System

Complex Systems and Networks

Intelligent Manufacturing

Papers on other topics in related subject areas are also welcome.

留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    05月09日

    2019

    05月11日

    2019

  • 11月15日 2018

    摘要截稿日期

  • 11月20日 2018

    摘要录用通知日期

  • 12月15日 2018

    初稿截稿日期

  • 12月30日 2018

    提前注册日期

  • 02月01日 2019

    初稿录用通知日期

  • 05月11日 2019

    注册截止日期

联系方式
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询