IEEE International Interconnect Technology Conference (IITC 2019) and the Materials for Advanced Metallization Conference (MAM 2019) will be held at the Radisson Blu Royal Hotel, Brussels, Belgium, June 3 - 6, 2019.

The 22nd edition of IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted of advanced metallization and 3D integration for ULSI IC applications.  Starting as a workshop on refractory metals and silicides in the 1980’s and moving towards advanced metallization in 1995, the 28th edition of MAM is devoted to research on materials properties and interactions of interconnect and silicide materials.  These two conferences will be combined again in 2019 for the 3rd joint IITC-MAM conference.  

This year’s conference will be held in Brussels, Belgium at the heart of Europe.  The conference location is easily accessible from the national airport and central station.  It is close to the Grand Place / Grote Markt at the center of Brussels, where history, art, culture, architecture, culinary delights meet.