2018 30th International Conference on Microelectronics ICM

活动简介

The International Conference on Microelectronics (ICM) has been held in numerous countries across the Southern Europe and Western and Southern Asia for the past 29 years. The 30^th edition of the conference will be hosted by Computer and Embedded Systems Laboratory (CES lab) in Tunisia. In ICM 2018, several topics will be discussed such as Circuits and Systems, CAD Tools and Design and Micro/Nano electronics and special topics. It will include oral, poster sessions and tutorials given by experts in state-of-the-art topics. The regular technical program will run for three days. Moreover tutorial sessions will be held on the first day of the conference. Perspective authors are invited to upload full papers using the ICM2018 Electronic Submission Portal below.

征稿信息

重要日期

2018-07-15

初稿截稿日期

You are invited to upload full papers using the ICM2018 Electronic Submission Portal below. Regular papers should be prepared with the official IEEE paper template of no more than 4 pages including results, figures and references. Your submission should contain sufficient details to allow for critical review. All submissions will be evaluated by at least two reviewers.

征稿范围

Papers are solicited in, but not limited to, the following topics:
GENERAL CIRCUITS AND SYSTEMS
ANALOG AND RF CIRCUIT DESIGN TECHNIQUES
DIGITAL SIGNAL AND DATA PROCESSING
WIRELESS COMMUNICATION SYSTEMS
NONLINEAR CIRCUITS
SYSTEM ON CHIP (SOCS)
VLSI FOR SIGNAL AND IMAGE PROCESSING
INTEGRATED ANTENNA AND FRONT-END CO-DESIGN
SIGNAL PROCESSING IN COMMUNICATIONS
CAD TOOLS AND DESIGN
SIMULATION (PROCESS, DEVICE, CIRCUIT, LOGIC, TIMING, FUNCTIONAL)
LAYOUT (PLACEMENT, ROUTING, FLOOR PLANNING, SYMBOLIC, ERC, DRC)
SILICON OPTIMIZATION
PARALLEL EMBEDDED SYSTEMS
TESTING: FORMAL VERIFICATION
CAD FOR FPGAS
HIGH LEVEL SYNTHESIS TOOLS
DESIGN AND TESTABILITY
MICRO/NANO ELECTRONICS
DEVICE CHARACTERIZATION AND MODELING
DEVICE PHYSICS AND NOVEL STRUCTURES
PROCESS TECHNOLOGY, CMOS, BJT
BICOMS, GAAS
RELIABILITY AND FAILURE ANALYSIS
OPTOELECTRONICS
MEMS DEVICES
PACKAGING AND SURFACE MOUNT TECHNOLOGY