2019 Electron Devices Technology and Manufacturing Conference EDTM

活动简介

EDTM - a Brief History

Launched in 2017 in Toyama, Japan, and sponsored by the IEEE Electron Devices Society (EDS). EDTM is fast becoming a flagship conference of IEEE EDS, with expanded focus on Advanced Technology Manufacturing. In 2018, EDTM was successfully held in Kobe, Japan, and it was very well attended by more than 300 attendees and supported by close to 40 companies. EDTM is rapidly becoming a premier conference for the electron devices community, providing an unique forum to focus on research and development from leading universities and manufacturing companies worldwide on a broad range of device-related topics including materials, processes, devices, packaging, modeling, reliability, manufacturing, and yield. The conference location rotates among countries in Asia, coming to Singapore for the first time in 2019.

Mission of EDTM 2019

The 3rd Electron Devices Technology and Manufacturing (EDTM) Conference 2019 is a full four-day conference to be held in Singapore from March 12th to 15th, 2019, fully sponsored by the IEEE Electron Devices Society (EDS).
As semiconductor technology scaling challenges continues to grow, so should the industries collaborative efforts to overcome them must increase. The EDTM is intended to serve as a forum for the electron devices community to collaborate on topics ranging from devices, process/tools, materials, modeling/simulation, packaging and manufacturing, to create new and innovative technologies.

组委会

Steering Committee
EDS Vice President of Technical Committees & Meetings (Chair)	Ravi Todi	GLOBALFOUNDRIES
EDS President-Elect	Fernando Guarrin	GLOBALFOUNDRIES
EDS President	Samar Saha	Prospicient Devices
EDS Junior Past President	Albert Wang	University of California, Riverside
EDS Treasurer	Subramanian S. Iyer	University of California, Los Angeles
Past General Chair	Shuji Ikeda	Tei Solutions
Past General Chair	Hitoshi Wakabayashi	Tokyo Institute of Technology
General Co-Chair	Geok Ing Ng	Nanyang Technological University
General Co-Chair	MK Radhakrishnan	NanoRel

Executive Committee
General Co-Chair	Geok Ing Ng	Nanyang Technological University
General Co-Chair	MK Radhakrishnan	NanoRel
Technical Program Chair	Don Disney	GLOBALFOUNDRIES
Support Relations Chair	Edwin Teo	Nanyang Technological University
Publicity Chair	Xiao Gong	National University of Singapore
Publicity Vice Chair	Dennis Polla	Agency for Science, Technology and Research
Financial Chair	Kenneth Lee	Singapore-MIT Alliance for Research and Technology
Publication Chair	Chuan Seng Tan	Nanyang Technological University
Exhibition/Sponsorship Chair	Aaron Thean	National University of Singapore
Exhibition/Sponsorship Vice Chair	Arjun Kumar Kanthimahanti	Silterra
Local Arrangement Chair	Kah Wee Ang	National University of Singapore
Short Course/Tutorial Chair	Nagarajan Raghavan	Singapore University of Technology and Design
Secretary	Mary Teng	A’Tenga C.E.

International Advisory Committee
International Advisory Chair	Meyya Meyyappan	(EDS President-Elect)
International Advisory Vice Chair	Yoon Soon Fatt	Nanyang Technological University
	Pey Kin Leong	Singapore University of Technology and Design
	Andrew Wee	National University of Singapore
Member	Shu Ikeda	Tei Solutions
	Hitoshi Wakabayashi	Tokyo Institute of Technology
	Bin Zhao	ON semiconductor
	Mikael Ostling	KTH
	Stefan de Grant	IMEC
	Ramgopal Rao	Indian Institute of Technology, Delhi
	Kazunari Ishimaru	Toshiba
	Arokia Nathan	Cambridge University

Technical Program Committee
Sub-Committee: Devices (Group IV)
Chair	Naoto Horiguchi	Imec
Vice-chair	Yukinori Morita	AIST
Members	Kejun Xia	NXP Semiconductors
	Gong Xiao	National University of Singapore
	Minsoo Yoo	SK Hynix
	Yu Hongyu	Southern University of Science and Tech
	Masumi Saitoh	Toshiba Memory Corp.
	Hyungcheol Shin	Seoul National University
	Abhisek Dixit	IIT Delhi
Sub-Committee: Devices (Not Group IV)
Chair	Jong-Ho Lee	Seoul National University
Vice-chair	Carlo Reita	CEA-LETI
Members	Yi Yang	Tsinghua University
	Tian-Li Wu	National Chiao Tung University
	Navakanta Bhat	Indian Institute of Science, Bangalore
	Wang Hong	Nanyang Technological University
	Susthitha Menon	UKM

Sub-Committee: Materials
Chair	Iriya Muneta	Tokyo Institute of Technology
Vice-chair	Pei-Wen Li	National Chiao Tung University
Members	Paul Berger	Ohio State University
	Kazuhito Matsukawa	SUMCO
	Yang Xu	Zhejiang University
	Hiroyasu Yamahara	The University of Tokyo
	Tsang Tony	Nanyang Technological University
	Saptarshi Das	Pennsylvania State University
	Zengfeng Di	SIMIT
	Chun-Jung Su	National Nano Device Labs


Sub-Committee: Modeling
Chair	Dondee Navarro	Hiroshima University
Vice-Chair	Risho Koh	Renesas
Members	Paul Lining Zhang	Hong Kong University of Sci. and Tech.
	Xian-Ping Chen	Chongqing University
	Yogesh Singh Chauhan	Indian Institute of Technology, Kanpur
	Takeshi Naito	Toshiba Memory Corp.
	Michael Loong Peng Tan	Universiti Teknologi Malaysia
	Darsen Lu	National Cheng Kung University
	Andreas Schenk	ETH
	Liang Gengchiau	National University of Singapore

Sub-Committee: Reliability
Chair	Mahadeva Iyer Natarajan	GLOBALFOUNDRIES
Vice-Chair	Nagarajan Raghavan	SUTD
Members	Muhammad Ashraf Alam	Purdue University
	Durga Misra	New Jersey Inst. of Tech.
	Kin Leong Pey	Singapore University of Tech. and Design
	Tibor Grasser	TU Wien
	Jiaw-Ren Shih	TSMC
	Runsheng Wang	Peking University
	Mayank Srivastava	Indian Institute of Science, Bangalore
	Yung-Huei Lee	TSMC
	Norhayati Binti Soin	University of Malaya
	Thomas Kauerauf	Samsung

Sub-Committee: Process
Chair	Makoto Miura	Hitachi High-Technologies Corp.
Vice-chair	Yasutoshi Okuno	TSMC
Members	Xiaojun Guo	Shanghai Jiao Tong University
	Kazuo Nojiri	Lam Research Co., Ltd.
	Yasushi Akasaka	Tokyo Electron Technology Solutions Ltd.
	Byoung Hun Lee	Gwangju Inst. of Sci. and Tech.
	Sean Kang	Applied Materials
	Keiichi Nakazawa	Sony Semiconductor
	Yao-Jen Lee	NDL
	Subhash Rustogi	Silterra
	Kah Wee Ang	NUS
	Saurabh Lodha	IIT Bombay

Sub-Committee: Packaging
Chair	Piyush Gupta	Qualcomm
Vice-chair	Kamal Sikka	IBM
Members	Yoichiro Kurita	Toshiba
	Jin Kim	Google
	Kyeong Sool Seong	J-Devices
	Chih Hang TUNG	TSMC
	Eric Beyne	imec
	Kamal Sikka	IBM
	Naoki Oka	Applied Materials Japan, Inc
	Kriss Lee	Amkor
	Andrew Tay	SUTD
	Jian Cai	Tsinghua University
	Mukta Farooq
	Jiann Min Chin	AMD

Sub-Committee: Manufacturing
Chair	Angelo Pinto	Qualcomm
Vice-chair	Tomasz Brozek	PDF Solutions
Members	William Nehrer	Consultant
	Sanjiv Mittal	Applied Materials
	Coming Chen	Silicon Intellectual Property Technology
	Keizo Hiraga	Sony
	Steve Poon	Apple Inc.
	Hein Mun Lam	GLOBALFOUNDRIES
	Rebecca Mih	Lam Research Co., Ltd.
	Kim Sang-Cheon	LG Electronics

征稿信息

重要日期

2018-10-16

初稿截稿日期

征稿范围

We cordially invite you to submit papers for the 2019 IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2019). Papers are sought on any topic within the scope of the conference.

EDTM aims for highest quality, and all papers accepted would be subject to IEEE-EDS standard review processes and conference publishing guidelines.
Accepted and presented papers will be published in EDTM proceedings and will be included in IEEE Xplore. A selected number of high impact EDTM papers would be invited for the consideration of publication in the IEEE Journal of Electron Devices Society (J-EDS) as extended version of EDTM conference papers following the IEEE publication policy and J-EDS author guidelines.
Authors of accepted papers will be requested to submit the IEEE copyright form by due date. Details will be announced in a notification of acceptance.

Presentation formats of contributed papers are oral or poster, and authors can choose it in the process of online paper submission. However please note that the Technical Program Committee has the right to make a final decision on the type of presentation associated with each paper.

Topics for EDTM 2019