活动简介

Continuing from the outstanding success of  IEEE UEMCON 2017, we are proud to present  IEEE UEMCON 2018 which will provide an opportunity for researchers, educators and students to discuss and exchange ideas on issues, trends, and developments in Information Technology, Electronics and Mobile Communication. The conference aims to bring together scholars from different disciplinary backgrounds to emphasize dissemination of ongoing research in the fields of in Information Technology, Electronics and Mobile Communication. Contributed papers are solicited describing original works in the above mentioned fields and related technologies. The conference will include a peer-reviewed program of technical sessions, special sessions, business application sessions, tutorials, and demonstration sessions. All accepted papers will be presented during the parallel sessions of the Conference and papers will be submitted for publication at IEEE Xplore Digital Library. IEEE UEMCON 2018 is listed in IEEE conference listing here.

This conference will also promote an intense dialogue between academia and industry to bridge the gap between academic research, industry initiatives, and governmental policies. This is fostered through panel discussions, keynotes, invited talks and industry exhibits where academia is exposed to state-of-practice and results from trials and interoperability experiments. The industry in turn benefits by exposure to leading-edge research in networking as well as the opportunity to communicate with academic researchers regarding practical problems that require further research.

One of the world’s great cities, New York City (known as “The Big Apple”, “NYC,” or just “New York”) is a global center for media, entertainment, art, fashion, research, finance, and trade. The bustling, cosmopolitan heart of the 4th largest metropolis in the world and by far the most populous city in the United States, New York has long been a key entry point and a defining city for the nation. From the Statue of Liberty in the harbor to the Empire State Building towering over the Manhattan skyline, from the tunnels of the subway to the skyscrapers of Wall Street, from the bright signs of Times Square to the naturalistic beauty of Central Park, and from Yankee Stadium in the Bronx to Coney Island in Brooklyn, New York’s landmarks are quintessential American landmarks. Please see the beauty of New York here.

组委会

General Co-Chairs

  • Joseph Finkelstein(Columbia University)
  • Son Vuong (University of British Columbia)
  • Satyajit Chakrabarti (Institute of Engineering & Management)

Technical Co-Chairs

  • Supriyo Bandyopadhyay(Virginia Commonwealth University)
  • Phillip Bradford (University of Connecticut)
  • Himadri Nath Saha (Institute of Engineering & Management)

Financial Chair

  • Charles Rubenstein (IEEE-USA)

Publication Chair

  • Nabeeh Kandalaft (Grand valley State University)

Technical Committee

  • Rakesh K. Kapania(Virginia Polytechnic Institute and State University)
  • Guohua Cao(Virginia Polytechnic Institute and State University)
  • Mehmet Akcakaya(University of Minnesota)
  • Wojciech Ziarko(University of Regina)
  • Moises Levy(Florida Atlantic University)
  • Detlef Streitferdt (Technische Universität Ilmenau)
  • KyriakosVamvoudakis (Virginia Polytechnic Institute and State University)
  • Jiangtao Cheng(Virginia Polytechnic Institute and State University)
  • Mike Turi(California State University)
  • Nilesh Khare(Ohio State University)
  • Ryan Gerdes(Virginia Tech University)
  • Nabeeh Kandalaft (Grand valley State University)
  • Supriyo Bandyopadhyay(Virginia Commonwealth University)
  • Phillip Bradford (University of Connecticut)
  • Miriam A. M. Capretz(Western University)
  • Sandipan Pramanik(University of Alberta)
  • Tuncer Ören(University of Ottawa)
  • Jie Han(University of Alberta)
  • Gul N. Khan(Ryerson University)
  • Sagar Naik(University of Waterloo)
  • Serguei Primak(Western University)
  • Amiya Nayak(University of Ottawa)
  • Abdessamad Ben Hamza(Concordia University)
  • Rachida Dssouli(Concordia University)
  • Ke-Lin Du(Concordia University)
  • Fei Yuan(Ryerson University)
  • George Karakostas (McMaster University)
  • Mustapha C.E. Yagoub(Université d'Ottawa)
  • Kamal El-Sankary(Dalhousie University)
  • Rasit Eskicioglu(University of Manitoba)
  • Carson K. Leung (University of Manitoba)
  • Gil Alterovitz(MIT CSAIL)
  • Svetlana Yanushkevich(University of Calgary)
  • Feng Li(University of Idaho)
  • Malka N. Halgamuge(The University of Melbourne)
  • Aravinda Rao(University of Melbourne)
  • Yasser Jafer(University of Ottawa)
  • Hamed Aly(Acadia University)
  • Adam W. Skorek(University of Québec at Trois-Rivières)
  • Amr Abdel-Dayem(Laurentian University)
  • Xing Liu(Kwantlen Polytechnic University)
  • Balbir Gill(Simon Fraser University)
  • Sylvain Giroux(University of Sherbrooke)
  • Marimuthu Swami Palaniswami(University of Melbourne)
  • Hua Lee(University of California)
  • Qingsheng Zeng(University of Ottawa)
  • Ranjith R Unnithan(University of Melbourne)
  • Gang Tao (University of Virginia)
  • Avik Ghosh(University of Virginia)
  • Saied Taheri(Virginia Tech University)
  • Nicolas H Younan(Mississippi State University)
  • Rolf Mueller(Virginia Tech University)
  • Paolo Garza(Politecnico di Torino)
  • Chandra Krintz(UC Santa Barbara)
  • S M Shafiul Alam(Kansas State University)
  • Thomas Kunz(Carleton University)
  • Ning Weng(Southern Illinois University)
  • Stephen L. Scott(Tennessee Technological University (TTU)
  • Jason Xuan(Virginia Tech University)
  • Diego Bellan(Politecnico di Milano)
  • Mehran Mehregany(Case Western Reserve University)

  • Zhongping Jiang (NYU Tandon School of Engineering)

  • Fabrizio Amarilli (Fondazione Politecnico di Milano)
  • Henning Schulzrinne (Columbia University)
  • Stefano Iannucci (Mississippi State University)
  • Benjamin F. Mallard(California State University, Northridge)
  • Wencen Wu (Rensselaer Polytechnic Institute)
  • Zoran Kostic(Columbia University)
  • Maxwell Young(Mississippi State University)
  • Michael Shur (Rensselaer Polytechnic Institute)

  • Dariusz Czarkowski (NYU Tandon School of Engineering)

  • Wei Lin (Case Western Reserve University)

  • Surinder Dhanjal (Thompson Rivers University)
  • Md. Kawsar Alam (Bangladesh University of Engineering and Technology)
  • Indranil Bhattacharya (Tennessee Tech University)
  • Shiva Kumar (McMaster University)
  • Maya Prica (Case Western Reserve University)
  • Sherif Abdelwahed (Virginia Commonwealth University)

  • Nazim Madhavji (University of Western Ontario)

  • Kan Chen (Kansas State University)
  • Quanyan Zhu (NYU Tandon School of Engineering)
  • Philip Feng (Case Western Reserve University)
  • WonSook Lee (University of Ottawa)
征稿信息

重要日期

2018-06-22
初稿截稿日期
2018-07-31
初稿录用日期
2018-08-31
终稿截稿日期

Prospective authors are invited to submit manuscripts reporting original unpublished research and recent developments in the topics related to the conference. It is required that the manuscript follows the standard IEEE camera-ready format (IEEE standard format, double column, 10-point font). Submissions must include title, abstract, keywords, author and affiliation with email address. Please double-check the paper size in your page setup to make sure you are using the letter-size paper layout (8.5 inch X 11 inch). The paper should not contain page numbers or any special headers or footers.

The IEEE templates in Microsoft Word (US Letter) and LaTeX format can be found at: http://www.ieee.org/conferences_events/conferences/publishing/templates.html

Details can also be found in the Call for Papers PDF file: here

IEEE UEMCON Paper Categories

  • Regular Paper – 7 pages maximum (3 additional pages allowed but at an extra charge)
  • Short Paper (Work-in-Progress) – 6 pages maximum (2 additional pages allowed but at an extra charge)
  • Poster – 5 pages maximum

Regular papers should present novel perspectives within the general scope of the conference. Short papers (Work-in-Progress) are an opportunity to present preliminary or interim results. Posters are intended for ongoing research projects, concrete realizations, or industrial applications/projects presentations.

Topics and technical areas of interest include but are not limited to the following:

Track I: Computing

 

  • Big Data, Data Management  and Analytics
  • Cloud Computing and Data Center Systems
  • Distributed OS & Middleware
  • Algorithms and Theory
  • Security and Privacy
  • Energy Management and Green Computing
  • Sensor Networks & Systems
  • Mobile and Wireless Computing
  • Cryptography and Applied Mathematics
  • File and Storage Systems
  • Local Algorithms and Congestion Aware Algorithms
  • Artificial Intelligence
  • Mobile Computing
  • Natural Language Processing
  • Signal and Image Processing
  • Information Retrieval
  • Machine Learning
  • Internet of Things
  • Cloud Computing in E-Commerce Scenarios
  • E-Business Systems Integration and Standardization
  • E-government
  • Electronic Business Model and Method
  • E-Commerce Risk Management
  • E-Commerce Dependability
  • Recommender system
  • Ontology Engineering for E-Commerce
  • Semantic Web Service Architecture for E-Commerce
  • Service Oriented E-Commerce and Business Processes
  • Data Analytics and Big Data

Track II: Electronics

 

  • VLSI and Microelectronic Circuit Embedded Systems
  • System on Chip (SoC) Design
  • FPGA (Field Programmable Gate Array) Design and Applications
  • Electronic Instrumentations
  • Electronic Power Converters and Inverters
  • Electric Vehicle Technologies
  • Control Theory and Applications
  • Robotics and Autonomous Systems
  • Intelligent Control
  • Optimal Control
  • Robust Control
  • Adaptive Control
  • Linear and Nonlinear Control Systems
  • Complex Adaptive Systems
  • Industrial Automation and Control Systems Technology
  • Modern Electronic Devices

Track III: Mobile Communication

 

  • Ad hoc networks
  • Body and personal area networks
  • Cloud and virtual networks
  • Cognitive radio networks
  • Cooperative communications
  • Delay tolerant networks
  • Future wireless Internet
  • Green wireless networks
  • Local dependent networks
  • Location management
  • Mobile and wireless IP
  • Mobile computing
  • Multi-hop networks
  • Network architectures
  • Network Security
  • Routing, QoS and scheduling
  • Satellite communications
  • Self-organising networks
  • Telecommunication Systems
  • Vehicular networks
  • Wireless multicasting, broadcasting and geocasting
  • Wireless sensor networks

Track IV: Informatics and Engineering Applications in Medicine and Biology

 

  • Data science, advanced analytics and big data in health
  • Knowledge discovery and data mining in healthcare
  • Natural language processing
  • Ontology development for medical knowledge representation and management
  • Digital and Connected Health
  • Serious games for health
  • Virtual and augmented reality applications in healthcare
  • Telemedicine and telerehabilitation
  • Learning Healthcare Systems and Big Data
  • Innovations in clinical decision support
  • Engineering applications in biology and medicine
  • Mobile health, health sensors, and wearable appliances
  • Translational bioinformatics and electronic phenotyping
  • Bioinformatics applications for precision health
  • Novel techniques for the integration of biological and clinical data
  • Bioinformatics for molecular diagnostics and prognostics

作者指南

Submission of papers will be handled electronically via EDAS.

Guideline for authors of accepted papers

  • Register for IEEE UEMCON 2018. Registration can be done at EDAS. Note that registration is completed once payment is sent via EDAS. Registration is a pre-requisite for the next steps, so please register as soon as possible.
  • If you require a visa support letter, please download the form from here, fill your details and mail it to us as soon as possible. Please read the guide before sending the visa letter form.
  • Download the copyright agreement form from below, fill in your details and add your signature. Please send the copyright form to secretary@ieee-uemcon.org.
  • Upload the camera ready paper to EDAS. Please check the similarity score of the paper prior to uploading and ensure the appropriate copyright notice is added to the bottom of the first page of the camera ready paper. Details about using PDF Express and copyright notice can be obtained below.
  • Upload your presentation to EDAS.

Links to documents

  • Copyright notice for final paper: PDF
  • PDF eXpress Instructions for Authors: PDF
  • Copyright Agreement Form: Download from here
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重要日期

  • 会议日期

    11月08日

    2018

    至

    11月10日

    2018

  • 06月22日 2018

    初稿截稿日期

  • 07月31日 2018

    初稿录用通知日期

  • 08月31日 2018

    终稿截稿日期

  • 09月17日 2018

    提前注册日期

  • 11月10日 2018

    注册截止日期

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