活动简介

Continuing from the outstanding success of IEEE IEMCON 2017, we are proud to present IEEE IEMCON 2018 which will provide an opportunity for researchers, educators and students to discuss and exchange ideas on issues, trends, and developments in Information Technology, Electronics and Mobile Communication. The conference aims to bring together scholars from different disciplinary backgrounds to emphasize dissemination of ongoing research in the fields of Information Technology, Electronics and Mobile Communication. Contributed papers are solicited describing original works in the above mentioned fields and related technologies. The conference will include a peer-reviewed program of technical sessions, special sessions, business application sessions, tutorials, and demonstration sessions. All accepted papers will be presented during the parallel sessions of the Conference and papers will be submitted for publication at IEEE Xplore Digital Library (Scopus, DBLP, Ei Compendex, Web of Science and Google Scholar).Extended Version of accepted and presented papers will be submitted for publication at special issue in Sensors(MDPI) Journal(http://www.mdpi.com/journal/sensors/special_issues/SITEMC). IEEE IEMCON 2018 is listed in IEEE conference listing here. This Conference is sponsored by IEEE Vancouver Section, University of British Columbia- Wireless Networks and Mobile Systems Laboratory , Symroc, Aidant Intelligent Technology, Health Gauge, MR Control System International Inc., Novarc, Quirk Logic, Trakopolis & NCS Multistage,canadian Space Agency.

This conference will also promote an intense dialogue between academia and industry to bridge the gap between academic research, industry initiatives, and governmental policies. This is fostered through panel discussions, keynotes, invited talks and industry exhibits where academia is exposed to state-of-practice and results from trials and interoperability experiments. The industry in turn benefits by exposure to leading-edge research in networking as well as the opportunity to communicate with academic researchers regarding practical problems that require further research.

Vancouver, a bustling west coast seaport in British Columbia, is among Canada’s densest, most ethnically diverse cities. A popular filming location, it’s surrounded by mountains and invites outdoor pursuits of all kinds, but also has thriving art, theatre and music scenes. Vancouver Art Gallery is known for its works by regional artists, while the Museum of Anthropology houses preeminent First Nations collections. Please see the beauty of Vancouver here and top 10 attractions of Vancouver here.

组委会

General Co-Chairs

  • Victor Leung (University of British Columbia)
  • Son Vuong (University of British Columbia)
  • Satyajit Chakrabarti (Institute of Engineering & Management)

Technical Co-Chairs

  • Jenq-Neng Hwang(University Of Washington)
  • Uwe Glasser(Simon Fraser University)
  • Bob Gill (British Columbia Institute of Technology)
  • Himadri Nath Saha (Institute of Engineering & Management)

Publication Chair

  • Nabeeh Kandalaft (Grand Valley State University)

Industry Relation Chair

  • Ndoh Moise (National Research Council)

Workshop/Tutorial chair

  • Edmond Cretu(University of British Columbia)

Financial chair

  • Himadri Nath Saha(Institute of Engineering and Managemnt)

Technical Committee

  • Jenq-Neng Hwang(University Of Washington)
  • Attila Altay Yavuz (Oregon State University )
  • Myungchul Kim (kaist school of computing)
  • Khalil Abuosba (Ryerson University)
  • Hiroshi Furukawa (University of Tsukuba)
  • Chyi Ren Dow (Feng Chia University, Taichung)
  • Herbert H. Tsang (Trinity Western University)
  • Adam W. Skorek (University of Québec)
  • Kamran Arshad (Ajman University)
  • Wojciech Ziarko (University of Regina)
  • Darrell Koskinen (TELUS)
  • Gul N. Khan (Ryerson University)
  • Xing Liu (Kwantlen Polytechnic University )
  • Parimala Thulasiraman (University of Manitoba)
  • Supriyo Bandyopadhyay (Virginia Commonwealth University)
  • Edmond Cretu (University of British Columbia )
  • Kun Hua (Lawrence Technological University)
  • Haibin Zhu (Nipissing University)
  • Tuncer Ören (university of ottawa)
  • Ke-Lin Du (Concordia University)
  • Paul R. Berger (ohio state university)
  • Nabeeh Kandalaft (Grand Valley State University )
  • Suresh Singh(Portland State University)
  • Xiaoyu Song (Portland State University)
  • Juan (Jen) Li (North Dakota State University)
  • Uwe Glässer (Simon Fraser University)
  • Robert Mitchell(Mitre Corporation)
  • Gordon Huang(University of Regina)
  • Abhijit Sen (Kwantlen Polytechnic University)
  • Mustapha C.E. Yagoub(University of Ottawa)
  • Phillip Bradford (University of-Connecticut)
  • James Giesbrecht (Ebor Systems Pty Ltd)
  • Surinder Dhanjal (Thompson Rivers University)
  • Sergio G. Camorlinga(University of Winnipeg)
  • James B. Cole(Air Force Institute of Technology)
  • Cliff C. Zou (University of Central Florida)
  • Balasubramani R(NMAM Institute of Technology)
  • Valentina Donzella(University of Warwick)
  • Gresha S Bhatia(Vivekanand Education Society's Institute of Technology)
  • Rama Murthy(International Institute of Information Technology, Hyderabad)
  • Sumit Kumar Jha(University of Central Florida)
  • Rinki Sharma(M.S.Ramaiah University)
  • Nong Ye (Arizona state university)
  • Gang Tao (Virginia state university)
  • Mandeep Pannu(Kwantlen Polytechnic University)
  • Yannet Interian (University of San Francisco)
  • Timothy Roden(Lamar University)
  • Dimitris Anagnostou(Heriot Watt University)
  • Zhonghen Luo(McMaster University)
  • Jun Qin (Southern Illinois University Carbondale)
  • Md. Kawsar Alam(Bangladesh University of Engineering and Technology)
  • Mike Turi(California State University)
  • Syed Sibte Raza Abidi(Dalhousie University)
  • John Ball(Mississippi State University)
  • Raghav V. Sampangi(Dalhousie University)
  • Mehmet Akcakaya (University of Minnesota)
  • Ryan Shea (Simon Fraser University)
  • Francois Chan(Royal Military College of Canada)
  • Behrooz Parhami(University of California)
  • Tamara Kneese(University of San Francisco)
  • Athula Rajapakse(University of Manitoba)
  • Sherif Saad(University of Windsor)
  • Mehdi Kargar(University of Windsor)
  • Violet R. Syrotiuk(Arizona State University)
  • Fei Yuan(Ryerson University)
  • Michael Fire(University of Washington)
  • Moises Levy(Florida Atlantic University)
  • Detlef Streitferdt(Technische Universität Ilmenau)
  • Michel Fattouche(University of Calgary)
  • Malleswara Talla(Concordia University)
  • Sazzadur Chowdhury(University of Windsor)
  • Raveendra Rao(Western University)
  • Sagar Naik(University of Waterloo)
  • Sandipan Pramanik(University of Alberta)
  • Umar Iqbal(Royal Military College of Canada)
  • Guo-Xing Miao (University of Waterloo)

  • Masum Hossain (University of Alberta)

  • Hassan Khosravi (The University of Queensland)

  • Francois Chan (Royal Military College of Canada)

  • Yong Gao (University of British Columbia)

  • Hiren Patel(University of Waterloo)

  • Noureddine Chabini (Royal Military College of Canada)

  • Bernhard Bauer (University of Augsburg)

  • Ramon Lawrence (University of British Columbia)
  • Hikyoo Koh (Lamar University)
  • Uttam Ghosh (Vanderbilt University)

  • Jorge Poco Medina(University of Washington)

征稿信息

重要日期

2018-06-15
初稿截稿日期
2018-07-24
初稿录用日期

Topics and technical areas of interest include but are not limited to the following:

Track I: Information Technology

 

  • Business Intelligence and Applications
  • Computer Network
  • Evolutionary Computation and Algorithms
  • Intelligent Information Processing
  • Information System Integration and Decision Support
  • Image Processing and Multimedia Technology
  • Information Security and Encoding Technology
  • Signal Detection and Processing
  • Technique and Application of Database
  • Data Mining
  • Software Engineering
  • Mobile Computing
  • Distributed Systems
  • Artificial Intelligence
  • Visualization and Computer Graphic
  • Information Retrieval
  • Natural Language Processing
  • Machine Learning
  • Internet of Things
  • Cloud Computing in E-Commerce Scenarios
  • E-Business Systems Integration and Standardization
  • E-government
  • Electronic Business Model and Method
  • E-Commerce Risk Management
  • E-Commerce Dependability
  • Recommender system
  • Ontology Engineering for E-Commerce
  • Semantic Web Service Architecture for E-Commerce
  • Service Oriented E-Commerce and Business Processes
  • Data Analytics and Big Data
 Track II: Electronics

 

  • VLSI and Microelectronic Circuit Embedded Systems
  • System on Chip (SoC) Design
  • FPGA (Field Programmable Gate Array) Design and Applications
  • Electronic Instrumentations
  • Electronic Power Converters and Inverters
  • Electric Vehicle Technologies
  • Control Theory and Applications
  • Robotics and Autonomous Systems
  • Intelligent Control
  • Optimal Control
  • Robust Control
  • Adaptive Control
  • Linear and Nonlinear Control Systems
  • Complex Adaptive Systems
  • Industrial Automation and Control Systems Technology
  • Modern Electronic Devices 
  • Track III: Mobile Communication

     

  • Ad hoc networks
  • Body and personal area networks
  • Cloud and virtual networks
  • Cognitive radio networks
  • Cooperative communications
  • Delay tolerant networks
  • Future wireless Internet
  • Green wireless networks
  • Local dependent networks
  • Location management
  • Mobile and wireless IP
  • Mobile computing
  • Multi-hop networks
  • Network architectures
  • Network Security
  • Routing, QoS and scheduling
  • Satellite communications
  • Self-organising networks
  • Telecommunication Systems
  • Vehicular networks
  • Wireless multicasting, broadcasting and geocasting
  • Wireless sensor networks

作者指南

Prospective authors are invited to submit manuscripts reporting original unpublished research and recent developments in the topics related to the conference. It is required that the manuscript follows the standard IEEE camera-ready format (IEEE standard format, double column, 10-point font). Submissions must include title, abstract, keywords, author and affiliation with email address. Please double-check the paper size in your page setup to make sure you are using the letter-size paper layout (8.5 inch X 11 inch). The paper should not contain page numbers or any special headers or footers.

The IEEE templates in Microsoft Word (US Letter) and LaTeX format can be found at :

http://www.ieee.org/conferences_events/conferences/publishing/templates.html

Details can also be found in the Call for Papers PDF file: here

IEEE IEMCON Paper Categories

  • Regular Paper – 7 pages maximum (3 additional pages allowed but at an extra charge)
  • Short Paper (Work-in-Progress) – 6 pages maximum (2 additional pages allowed but at an extra charge)
  • Poster – 5 pages maximum

Regular papers should present novel perspectives within the general scope of the conference. Short papers (Work-in-Progress) are an opportunity to present preliminary or interim results. Posters are intended for ongoing research projects, concrete realizations, or industrial applications/projects presentations.

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重要日期

  • 会议日期

    11月01日

    2018

    至

    11月03日

    2018

  • 06月15日 2018

    初稿截稿日期

  • 07月24日 2018

    初稿录用通知日期

  • 09月10日 2018

    提前注册日期

  • 11月03日 2018

    注册截止日期

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