ISTP symposium series has been organized successfully since its first symposium of ISTP1 in Honolulu, Hawaii, and this year, it will be held again in Honolulu. The success of this symposium series owes a lot to the past contributors and organizers who have nurtured the spirit of academics and technological exchanges under a relaxing atmosphere, which is believed to be the essential foundation of the symposium.
Honolulu is therefore picked as the symposium venue which is one of the top tourist destinations. This is a huge opportunity for the participants to exchange up-to-date research and technological information as well as to deepen mutual relationship for future collaborations across the countries and regions in session rooms, at the coffee breaks and symposium events, and also at the various relaxing and exciting off-the-venue locations in Honolulu.
Symposium Chair:
Masaru Ishizuka, Toyama Prefectural University
Symposium Co-Chair:
Kazuyoshi Fushinobu, Tokyo Institute of Technology
Secretary General:
Tomoyuki Hatakeyama, Toyama Prefectural University
Adviser:
Sadanari Mochizuki, Pacific Center of Thermal and Fluid Engineering, Tokyo University A & T
Honorary Committee:
Ishizuka, M., Toyama Prefectural University
Ay, H., National Kauohsiung Unversity of Applied Sciences
Brynjolfsson, S., University of Iceland
Cervantes de Gortari,J., National Univ. of Mexico
Chan, S. H., Yuan Ze University
Charoenphonphanich, C., KMITL
De Vahl Davis, G., Univ. of New South Wales
Dincer, I., University of Ontario Institute of Technology
Djilali, N., University of Victoria
Dost, S., University of Victoria
Hanamura, K., Tokyo Institute of Technology
Iguchi, M., Hokkaido University
Jezek, J., Czech Technical University in Prague
Lee, J. S., Seoul National University
Lee, S. Y., KAIST
Mallinson, G., University of Auckland
Mochizuki, S., Tokyo University of A&T
Rajapaksha, L., University of Peradenya
Raupenstrauch, H., Montanuniversitaet Leoben
Spitas, C., Delft University of Technology
Suzuki, K., Tokyo University of Science at Yamaguchi
Takeishi, K., Osaka Univesity
Tomimura, T., Kumamoto University
Wang, B. X., Tsinghua University
Winoto, S. H., National University of Singapore
Yanuar, University of Indonesia
Zuna, P., Czech Technical University in Prague
International Scientific Committee:
Agonafer, Dereje, University of Texas
Amano, Ryo S., University of Wisconsin-Milwaukee
Arima, Hirofumi, Saga University
Asano, Hitoshi, Kobe University
Atarashi, Takayuki, Hitachi, Ltd.
Bois, G., ENSAM Lille
Carlomagno, G.M., University of Napoles
Fukue, T., Iwate University
Fumoto, Koji, Aoyama Gakuin University
Fushinobu, K., Tokyo Institute of Technology
Haramura, Yoshihiko, Kanagawa University
Hatakeyama, T., Toyama Prefectural University
Hirasawa, Shigeki, Kobe University
Hirose, Koichi, Iwate University
Hirota, Masafumi, Mie University
Hong, C. W., National Tsing Hua University
Horibe, Akihiko, Okayama University
Horiuchi, Keisuke, Hitachi Co.Ltd.
Ichimiya, Koichi, University of Yamanashi
Inoue, M., KOMATSU
Iwai, Hiroshi, Kyoto University
Iwamoto, Kaoru, Tokyo University of Agriculture and Technology
Joshi, Y., Georgia Tech
Kajita, Yasushi, Nagoya Municipal Industrial Research Institute
Kano, Ichiro, Yamagata University
Kawanami, Tsuyoshi, Meiji University
Kedzierski, M., NIST
Kikura, Hiroshige, Tokyo Institute of Technology
Kim, Sung Jin, KAIST
Kim, M.S., Seoul National University
Kobayashi, Kenichi, Meiji University
Koizumi, Katsuhiro, DENSO Corporation
Komiya, A., Tohoku University
Kondo, Yoshihiro, Hitachi, Ltd.
Kunugi, Tomoaki, Kyoto University
Kuwahara, Fujio, Shizuoka University
Kuzma-Kichta, Y. A., Moscow Power Eng. Institute
Li, H.Y., Huafan University
Maruyama, S., National Institute of Technology, Hachinohe College
Maruyama, Shigeo, The University of Tokyo
Matsumoto, Koji, Chuo University
Matsumoto, Mitsuhiro, Kyoto University
Matsumoto, Ryosuke, Kansai University
Matsushima, Hitoshi, Nihon University
Miyagawa, K., Waseda University
Miyazaki, Koji, Kyushu Institute of Technology
Monde, M., Saga University
Motosuke, Masahiro, Tokyo University of Science
Munakata, Tetsuo, National Institute of Advanced Industrial Science and Technology
Murata, Akira, Tokyo University of Agriculture and Technology
Nagai, Niro, University of Fukui
Nagasaka, Yuji, Keio University
Nagayama, Gyoko, Kyushu Institute of Technology
Nakabe, Kazuyoshi, Kyoto University
Nakabeppu, Osamu, Meiji University
Nakagawa, Shinji, Toyama Prefectural University
Nakamura, Hajime, National Defense Academy
Nakamura, Yuji, Toyohashi University of Technology
Nakayama, Akira, Shizuoka University
Naylor, D., Ryerson University
Ng, Eddie, Nanyang Technical University
Nishi, Koji, NIDEC Corporation
Nomura, Shinfuku, Ehime University
Oda, Y., Kansai University
Ogushi, Tetsuro, Advanced Knowledge Laboratory, Inc.
Ohara, T., Tohoku University
Ohmura, Takahiro, National Institute of Technology, Wakayama College
Okajima, Junnosuke, Tohoku University
Okuyama, Masaaki, Yamagata University
Osone, Yasuo, Hitachi, Ltd.
Ozawa, Mamoru, Kansai University
Rosengarten, G., University of New South Wales
Roy, R.P., Arizona State University
Saito, Takushi, Tokyo Institute of Technology
Saitoh, Hironori, Sojo University
Satoh, Isao, Tokyo Institute of Technology
Senaha, Izuru, Ryukyu University
Shibahara, M., Osaka University
Shiomi, Junichiro, The University of Tokyo
Shirakashi, Ryo, The University of Tokyo
Someya, S., AIST
Suzuki, Hiroshi, Kobe University
Suzuki, K, Tokyo University of Science at Yamaguchi
Tabe, Yutaka, Hokkaido University
Tada, Yukio, Kanazawa University
Takata, Y., Kyushu University
Takeda, Tetsuaki, University of Yamanashi
Tanahashi, Mamoru, Tokyo Institute of Technology
Tomimura, T., Kumamoto University
Tong, Albert Y., University of Texas at Arlington
Torii, S., Kumamoto University
Toriyama, Koji, University of Yamanashi
Ueno, Ichiro, Tokyo University of Science
Vafai, K., UC Riverside
Wang, Q., Xi'an Jiaotong University
Yamada, Masahiko, Hokkaido University
Yang, Chien-Yuh, National Central University
Yazawa, Kazuaki, Purdue University
Yeh, L-T, Huawei Technologies
Yokono, Yasuyuki, The University of Tokyo
Yuki, K., Tokyo University of Science at Yamaguchi
Executive Committee:
Fushinobu, Kazuyoshi (Chair), Tokyo Institute of Technology
Hatakeyama, Tomoyuki (General Secretary), Toyama Prefectural University
Doan, Hong Duc, Vietnam National University at Hanoi
Fukue, Takashi, Iwate University
Hasmady, Saiful, Tenaga National University
Kibushi, Risako, Tokyo University of Science at Yamaguchi
Kim, Byunggi, KAIST
Koizumi, Katsuhiro, DENSO Corporation
Nishi, Koji, Nidec Corporation
Saitoh, Hironori, Sojo University
Yazawa, Kazuaki, Perdue University
Yokono, Yasuyuki, University of Tokyo
Yuki, Kazuhisa, Tokyo University of Science at Yamaguchi
SCOPE
Papers dealing with any aspect of transport phenomena and thermal-fluids engineering from fundamental sciences to applications in engineering systems and nature are solicited. Topics include but are not restricted to the following areas:
Bioengineering and Bio-thermal Fluid Dynamics
Boiling and Multi-Phase Flow
Combustion and Reacting Flows
Electronics Packaging and Thermal Management
Experimental/Computational Fluid Dynamics
Fuel Cells and Battery Technology
Heat and Mass Transfer
Heat Exchangers
Industrial Aerodynamics
Manufacturing and Materials Processing
MEMS
Micro- and Nano-Scale Transport
Noise and Vibration in Fluid
Sustainable & Renewable Energy
Thermal-Fluids Machinery
Thermal Hydraulics of Energy Reactors
Transport in Porous Media
Transport phenomena in solid mechanics and fluid-structure interaction
Turbulence and Flow Instabilities
Visualization/Imaging Techniques
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference. Author are invited to submit an abstract not exceeding 150 words to EasyChair via https://easychair.org/conferences/?conf=istp29 by May 1, 2018.
10月30日
2018
11月02日
2018
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