The IIT 2018 conference is an open forum for discussion of major challenges in current and emerging technologies related to the tools and processes for ion implantation, annealing of semiconductors and non-semiconductors, implanted devices, metrology of implanted layers and devices, as well as methods The conference offers welcome from a wide range of topics, from Fundamental research to industrial applications and equipment. The technical program will consist of invited and oral presentations as well as platform sessions.
Lothar Frey
Fraunhofer IISB
R einhard Ploss
Infineon
Volker Häublein
Fraunhofer IISB
Heiner Ryssel
Fraunhofer IISB
Werner Schustereder
Infineon
Lut z Ende
X-FAB
Anka Wahl
Fraunhofer IISB
Schottkystrasse 10
91058 Erlangen, Germany
Conference topics include, but are not limited to:
Equipment for Ion Implantation, Annealing, and Metrology
• Tools for advanced beam line ion implantation
• Tools for plasma doping, cluster, and molecular ion beams
• Equipment for thermal and a-thermal annealing (laser, microwave, flash, neutral beams, etc.)
• Metrology equipment for implantation control (particles, contamination, charging, etc.) and for implanted layers (implant profiling, sheet resistance, etc.)
• Advanced process control (tool software assisted, fab solutions, “tool health factors”)
Ion Implantation and Annealing of Semiconductor Materials
• Ion implantation and annealing of Si, Ge, SiC, GaN and other III-V semiconductors, graphene, etc.
• New doping techniques: monolayer doping, atomic layer deposition, selective CVD/epi, MOCVD, laser-assisted doping, thermal and recoil mixing methods, etc.
• Ion-assisted methods for advanced photovoltaic devices and photon energy-shifting layers, etc.
• Layer transfer for heterogeneous materials integration, 3D IC stacking, etc.
• Comparison of different annealing techniques
Ion Implantation and Annealing of Non-Semiconductor Materials
• Etch rate control
• Dielectric constant modification
• Photo resist stabilization for multi-exposure lithography, etc.
• Biotechnology: processing of bio-compatible surfaces and interfaces, fabrication of DNA-scale sensors and bio-active devices, etc.
Ion Implantation for Devices
• Power and RF devices (Si, Ge, SiC, GaN, etc.)
• Large-area devices (displays, solar cells, wearables, etc.)
• LEDs, MEMS, image sensors, chemical and physical sensors, etc.
• Planar and non-planar CMOS (FinFETs, nanowires, etc.), 3D memories, etc.
• Junction contact and metal gate work function engineering
• Photonic devices: CMOS-photonic integration, materials for multi-dimensional photonic signal processing and transmission, vertical-cavity surface-emitting lasers, etc.
• Nano-scale device fabrication for quantum confined films, wires and dots, quantum information processing, etc.
• Metrology methods: elemental, electrical, and morphological analysis of 3D devices, junctions, strain, interfaces and contacts, etc.
Modeling and Simulation of Ion Implantation
• Non-mainstream ion implantation methods (using plasma, high energy ions, atomic clusters, ion beam mixing, etc.)
• Ion implantation into novel and exotic materials or device structures
• Defect generation due to ion irradiation
• Sputtering and surface modification due to ion bombardment
• Ion beam assisted methods for near-surface material analysis (SIMS, RBS, etc.)
Abstract preparation Prospective authors are invited to submit one-page abstracts (including one or two figures) fabricated their new results.
Abstracts have to include title, author(s), affiliation(s), as well as e-mail address, and telephone number of the main author.
Abstracts should be one A4 page, either in Adobe PDF or in Microsoft Word format. The abstract should be formatted in Arial and include in the following order:
- Title (Arial, 14 pt bold, centered, title case)
- Presenting author and co-author affiliations, city, and country.
Be sure to include the presenting author's e-mail (Arial, 11 pt, centered)
- Abstract body (Arial, 10 pt)
Abstract submission deadline: May 18, 2018
The submission and review of abstracts for IIT 2018 will be managed through the online conference paper management system called EasyChair. This system gives you, the author, a complete control over your submission. You can upload your abstract and check on the review status of your submission. The Program Committee will review all abstracts and notify the results to the authors.
This guide is intended to support authors during the submission process. While the procedure is quite simple and therefore we do not anticipate users running into trouble, we are happy to help if you encounter problems. In the event that you do need help, please contact The technical chair at: iit2018@easychair.org.
Please note, if your abstract is accepted you will be required to submit a manuscript for the conference proceedings by September 14, 2018. Manuscript guidelines will be coming soon.
09月16日
2018
09月21日
2018
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