活动简介

Electronics, Smart Devices, Internet of Things, System On Chip, Electronic Devices

征稿信息

重要日期

2018-07-02
初稿截稿日期
2018-08-27
初稿录用日期
2018-09-24
终稿截稿日期

Smart Device emerges as a set of integrated technologies new exciting solutions and services that are set to change the way people live. Smart Device is rewarded by many as a fruitful future technological sector in order to enhance quality of our lives. Smart Device covers a large wealth of consumer centric technologies (from sensors to communications up to software platforms) and it is applicable to an even larger set of application domains (from manufacturing to e-health, smart payments, from logistics to automotive). Innovation will be nurtured and driven by the possibilities offered by the combination of increased technological capabilities, new business models and the rise of new ecosystems.

ISESD has become the premier gathering place where visionary, ground-breaking research meets leading industry experts in the field of electronics, smart device, and other related technologies. Topics include smart device system architecture, smart device enabling technologies, smart device services and applications, and the social implications of smart device.

ISESD is seeking for original, high impact research papers on all topics related to the development and social adoption of the Smart Devices. Papers are peer-reviewed and selected based on technical novelty, integrity of the analysis and social impacts and practical relevance.

The ISESD 2018 will include regular sessions on the topics listed below.

  • Devices, Circuits, and Systems
  • VLSI
  • Communication Systems
  • Multimedia and Systems
  • Signal Processing
  • Internet of Things
  • Cyberphysical System
  • Smart Devices

 

Prospective authors are invited to submit papers reflecting original, unpublished work in these fields. Papers should not exceed 6 pages including results, figures, and references. Manuscript templates will be made available on the website. Only electronic submissions with PDF files will be accepted via the symposium website.

The CD-ROM/Flash-drive proceedings of accepted papers will be made available at the symposium.

Authors are expected to present their papers at the symposium upon acceptance and presenting authors are required to register for the symposium. Only papers presented at the symposium will be submitted to IEEE for further review to be included in IEEEXplore database.

作者指南

Manuscript must be prepared in English with a maximum length of six (6) printed pages IEEE format (ten-point font) including figures. The symposium maintains the right to refrain from reviewing papers that are longer than 6 pages. For your submission you can use the standard IEEE conference templates for Microsoft Word or LaTeX formats which can be found at:

Technical paper must be submitted electronically via ISESD2018 paper submission system.

The format for the manuscript must satisfy the following requirements:

  • Manuscript must be in English.
  • The manuscript must follow IEEE two-column format with single-spaced, ten-point font in the text. The maximum manuscript length is six (6) pages. All figures, tables, references, etc. are included in the page limit.
  • Papers must be submitted in Portable Document Format (PDF).
  • Papers must be formatted for standard letter-size (8.5′′ x 11′′) paper.
  • Authors must submit their papers electronically via paper submission system.
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重要日期
  • 会议日期

    10月23日

    2018

    10月24日

    2018

  • 07月02日 2018

    初稿截稿日期

  • 08月27日 2018

    初稿录用通知日期

  • 09月24日 2018

    终稿截稿日期

  • 10月24日 2018

    注册截止日期

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Microelectronics Center
Institut Teknologi Bandung
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