DTIP'2018 will be the 20th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique single-meeting event brings together participants interested in MEMS/MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS/MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems are addressed in two main Conferences, Special Sessions and Invited Talks. Papers presented at the conference will appear in IEEE Xplore and extended version of the presented papers may be submitted for inclusion in a special issue of an indexed journal.
We look forward to welcoming you in Roma.
Research paper submission
DTIP aims to present the latest research in “Design, Integration, Test and Packaging of MEMS and MOEMS”. A program committee composed with international experts in their field will review all submitted papers. Even if abstracts of about 600 words will be considered, it is recommended to submit extended abstracts (up to 1500 words) plus one page of figures for efficient and fair scientific reviewing. Detailed instructions regarding electronic submissions are posted on the "Authors Information" section of the DTIP website.
Questions may be directed in the meantime by e-mail (dtip@dtip-mems.org).
Product-oriented papers
Companies that want to advertise their products (such as sensors, equipments or CAD tools) are discouraged to submit a research paper if there is no revelation of any scientific contribution or rupture with respect to the state-of-the-art. In that case, it is recommended to consider becoming a sponsor of the conference to benefit from a large audience (an oral presentation in a plenary session).
Special session on “Microsystems integration in textiles”
Integration of electronic microsystems into textiles is a growing research topic with enormous potential to impact on a diverse range of industries, from automotive to healthcare and fashion to aerospace. In this special session we would like to address new innovations in smart textile technology, with a focus on the integration and packaging of microsystems within the textiles. Papers on smart textiles and wearable technology are welcomed, with a focus on, embedded systems, durability, washability, scalability, interconnections and manufacturing.
Organizer: Russel TORAH - rnt@ecs.soton.ac.uk - University of Southampton, UK
Special session on “Latest advances in micro-fluidics and bioMEMS”
During the past ten years, lab-on-a-chip developments haves been largely motivated by medical applications. These studies open now the way to a large variety of principles with the aim to provide performing and reliable diagnosis tests or personalized follow-up devices. In this session we would like to promote reporting of latest development in this field. A particular attention will be paid to liquid biopsy approaches (circulating DNA/RNA, CTC, exosomes and extra cellular microvesicles).
Organizer: Anne-Marie GUE - gue@laas.fr - LAAS CNRS, Toulouse, FR
Special session on “MEMS for Space Applications”
In 2001, IEEE Spectrum published an article entitled “MEMS in Space” in which several predictions were made regarding the marriage of two technologies that were still emerging back then, namely, MEMS and small satellites. Since then, both MEMS and aerospace technologies have undergone deep transformations with MEMS becoming ubiquitous in our daily lives and the aerospace industry taking nano- and pico-satellites from mere educational projects to actual tools of Earth observation and space exploration. In this special session, we revisit some of the predictions made in the IEEE Spectrum article and highlight the state of the art and the future of using MEMS in CubeSats with particular focus on their navigation, propulsion, and payload subsystems.
Organizer: Ibrahim (Abe) M. ELFADEL - ielfadel@masdar.ac.ae - Khalifa University of Science and Technology, Abu Dhabi, UAE
Specific deadlines have been set-up for these special sessions:
Submission of extended abstracts (1500 words plus figures) before February, 12th,
Notification of acceptance before March, 5th,
Final papers (up to 6 pages, IEEE Format) before April, 9th.
05月22日
2018
05月25日
2018
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