The 13th European Microwave Integrated Circuits Conference (EuMIC) will be held in Madrid, Spain, as part of the European Microwave Week 2018. Initiated by the GAAS® Association in 1990 and renamed in 2006, the conference visits Madrid in 2018 for the first time.
The EuMIC conference is jointly organised by the GAAS® Association and EuMA and is the premier European technical conference for RF, microwave and photoelectronic. It has established itself as a key contributor to the success of the overall European Microwave Week and remains the largest scientific event in Europe related to microwave integrated circuits.
The aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications; encompassing all relevant aspects such as theory, simulation, design, and measurement. Research and innovation in this field helps to create the crucial enabling infrastructure for new and emerging information and communication applications, such as 5G communications, the Internet-of-Things or sustainable electronics.
Technological innovations continue to drive challenges for modelling and simulation as well as for the characterisation techniques applied at both device and circuit levels. While GaAs and silicon-based IC technologies are extensively used in today’s systems, emerging technologies such as wide-bandgap (SiC, GaN, etc.), CNT, and graphene-based devices are expected to become commercially available within the coming years, with a huge expected impact on system performance. Moreover, new materials and devices push integrated circuit capability to millimetre-wave and even to THz bands, while high-speed digital and optoelectronic integrated circuits represent other key areas of interest.
In the modelling area, topics related to device and system small- and large-signal characterisation, test set-ups, and modelling approaches up to the THz band are of interest. In the technology area, papers on nanotechnologies for microwaves, as well as wide-bandgap devices and technologies for microwave photonics are specifically solicited. Topics related to semiconductor devices, IC reliability and 3D-interconnects in ICs are also invited to the conference. Finally, contributions are encouraged in the areas of circuit design and applications, RF and microwave ICs, millimetre and sub-millimetre wave ICs, photonic ICs, mixed-signal and high-speed digital ICs, tunable and reconfi gurable ICs as well as integrated detectors, receivers, transmitters, and transceivers.
If you are interested in the subject of microwave and RF microelectronic devices and ICs, the EuMIC conference is an exceptional high-quality event to learn about the latest advances in the field and to meet internationally recognized experts from both industry and academia.
G1 Physics-based and Multi-physics Device Modelling and Simulation
G2 TCAD Device Modelling and Simulation
G3 Small Signal, Large Signal and Noise Modelling and Characterization:
G4 Linear and Non-linear CAD Techniques for Devices and Circuits
G5 Modelling of Passive RF, Microwave, mm-Wave and Photonic Components for ICs
G6 Advanced Packaging and Thermal Simulation of High Power Devices and ICs
G7 Nanotechnologies, Nanodevices and Nanomaterials for Microwaves
G8 III-V Compound Semiconductor Devices and IC Technologies
G9 Wide-Bandgap Semiconductor Devices and IC Technologies
G10 Si-based Semiconductor Devices and IC Technologies
G11 Device and IC Reliability, Manufacturing Processes and Testing
G12 3D-Interconnects in ICs
G13 Devices for Integrated Microwave Photonics
G14 New and Emerging Material and Device Concepts (Metamaterials, Graphene, Carbon Nanotubes, Organic, etc.)
G15 RF and Microwave Integrated Circuits
G16 Millimetre-Wave and Sub-Millimetre-Wave Integrated Circuits
G17 Low Noise Circuits and Modules (*)
G18 Single-chip Power Amplifiers
G19 Power Amplifiers: Efficiency Enhancement and Linearization (*)
G20 Si-Based, Mixed Signal, High Speed Digital ICs
G21 Microwave Power Silicon Devices
G22 Ultra Low-Power Integrated Circuits
G23 Tunable and Reconfi gurable Circuits and Systems (*)
G24 Integrated Receivers, Transmitters and Transceivers
G25 Microwave Photonic Circuits and Systems (*)
(*) common topic with EuMC
09月23日
2018
09月25日
2018
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2019年09月29日 法国 Paris
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