活动简介

The 20th International Conference on Electronics Materials and Packaging (EMAP 2018) will be held in Hong Kong, a gateway between the East and West. The purpose of the conference is to promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages. The EMAP 2018 committees are cordially invite researchers, engineers, scientists and professors and students to submit an abstract and join EMAP 2018. From the successful stories of previous EMAP in Japan, Korea, Malaysia Singapore, and Taiwan, this annual event is a great opportunity to group people from academia, research institutions and industries to share their innovative thoughts, state-of-the-art technologies and recent developments. The program includes invited and keynote presentation from world-renowned speakers, sharing sessions and technical short courses. Excursion will be arranged to show you the natural side of Hong Kong. Come and join us and see you in EMAP 2018.

征稿信息

重要日期

2018-07-31
摘要截稿日期
2018-11-15
初稿截稿日期
2018-08-31
初稿录用日期
2018-11-15
终稿截稿日期

Topics:

  • Additive Manufacturing
  • Advanced Packaging
  • Emerging Technologies
  • High Density and 3D Packaging
  • Materials and Processing
  • MEMS Packaging and Applications
  • Modeling and Simulation
  • Optoelectronics and Photonics
  • Quality and Reliability Assessment
  • Thermal Management
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重要日期
  • 会议日期

    12月17日

    2018

    12月20日

    2018

  • 07月31日 2018

    摘要截稿日期

  • 08月31日 2018

    初稿录用通知日期

  • 11月15日 2018

    初稿截稿日期

  • 11月15日 2018

    终稿截稿日期

  • 12月20日 2018

    注册截止日期

承办单位
Hong Kong University of Science and Technology
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