2018年国际3D电力电子集成与制造研讨会 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing 3D-PEIM 2018

活动简介

Following on the success of the inaugural symposium in 2016, the Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18) will be held on June 25-27, 2018. This symposium, to be held at the University of Maryland, College Park will bring together world-class experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. The focus will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

The conference will feature 26 invited lectures highlighted by a keynote address by Prof. Mark Johnson of the University of Nottingham, who is the Director of the EPSRC Center for Power Electronics. There will also be three tutorials, eight sessions that include contributed presentations, exhibits, and an interactive poster/demonstration session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com), and will be chaired by Prof. Patrick McCluskey of the University of Maryland, College Park.

征稿信息

重要日期

2017-12-15

摘要截稿日期

2018-04-06

初稿截稿日期

2018-01-19

初稿录用日期

2018-04-06

终稿截稿日期

Members of the worldwide electronics community are encouraged to submit abstracts for the second international symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). This symposium will bring together practitioners and researchers to share, discuss, and roadmap the latest developments in circuits and systems enabled through advancements in 3D packaging, integration, and manufacturing technologies. The symposium will have a full program of tutorials, invited presentations, contributed papers, interactive sessions, table-top exhibits, and laboratory tours.

Contributed papers are sought that address important challenges related to the packaging and manufacturing of smaller, lighter, more efficient, and sustainable power electronic products, especially in the following topic areas:

Additive Manufacturing
Embedded Components and Embedding Technologies
Systems Integration and Thermal Management for High-density Packaging
Multiphysics Modeling and Simulation of Integrated Packaging and Circuit Solutions
Materials (e.g., interconnects, encapsulants, substrates)
Heterogeneous Integration
Manufacturability of circuits and packaging (manufacturing processes, equipment, and standards)
Quality and Reliability, including Prognostics and Condition Monitoring