325 / 2017-12-08 20:12:40
AlGaN/GaN E-mode MOS-HEMT Using Atomic-Layer-Deposited HfLaO x as Gate Dielectric
E-mode,HEMT,High-k,Dielectric
终稿
Sichao Li / Huazhong University of Science and Technology
Qianlan Hu / Huazhong University of Science and Technology
Xin Wang / Huazhong University of Science and Technology
Mengfei Wang / Huazhong University of Science and Technology
Yanqing Wu / Huazhong University of Science and Technology
In this paper, we report GaN MOS-HEMTs with high quality atomic-layer-deposited HfLaO x as gate dielectric. The threshold voltage of recessed gate MOS-HEMT can be enhanced from -6.2 V to 0.8 V. The E-mode GaN MOS-HEMT exhibits ideal subthreshold swing ~ 66 mV/dec and high on-off ratio of 1.2×10^10 . Conductance method has been applied to reveal low Dit between high-κ/AlGaN interface. Effective mobility of D-mode and E-mode MOS-HEMTs are 1958 cm2/V·s and 1483 cm2/V·s, respectively. A high breakdown voltage of 840 V was achieved, thanks to suppressed gate leakage. The specific on-resistance of E-mode device is 1.86 mΩ·cm 2 and results in high power figure of merit (BV2 /Ron,sp ) of 380 MW/cm 2 .
重要日期
  • 会议日期

    05月17日

    2018

    05月19日

    2018

  • 12月08日 2017

    摘要截稿日期

  • 01月30日 2018

    摘要录用通知日期

  • 02月10日 2018

    初稿截稿日期

  • 02月10日 2018

    终稿截稿日期

  • 05月19日 2018

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
IEEE POWER ELECTRONIC SOCIETY
中国电源学会
中国半导体产业创新联盟
承办单位
西安交通大学
西安电子科技大学
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