322 / 2017-12-08 19:54:39
Layout of Series-connected SiC MOSFET Devices for Medium Voltage Applications
终稿
Li Chengmin / Zhejiang University
Renju Zheng / College of electrical engineering, Zhejiang University
Wuhua Li / College of electrical engineering, Zhejiang University
Huan Yang / College of electrical engineering, Zhejiang University
Xiangning He / College of electrical engineering, Zhejiang University
Weifeng Hu / State Grid Jiangsu Electric Power Co., Ltd.
A rated 9.6kV, 450A half-bridge module composed of eight series-connected 1.2kV SiC power MOSFETs is constructed. The key layout considerations in terms of the electrical, thermal and insulation issues are specially addressed from the application perspective. At first, the influence of the parasitic parameters and temperature variation on voltage imbalance of the series connected devices is analyzed briefly to guide the design of the layout. Then split heatsink scheme is adopted to enable reliable insulation. Meanwhile a balanced liquid cooling system is designed and verified at 180℃ operation. Afterwards the laminated busbar with a 62% stray inductance reduction compared with discrete busbar is proposed. Finally, an optimized layout of the snubber circuit is demonstrated with facilitated voltage balance benefit. The proposed module functions as a single SiC 9.6kV/450A half bridge module and can be adopted in the medium voltage converters flexibly.
重要日期
  • 会议日期

    05月17日

    2018

    05月19日

    2018

  • 12月08日 2017

    摘要截稿日期

  • 01月30日 2018

    摘要录用通知日期

  • 02月10日 2018

    初稿截稿日期

  • 02月10日 2018

    终稿截稿日期

  • 05月19日 2018

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
IEEE POWER ELECTRONIC SOCIETY
中国电源学会
中国半导体产业创新联盟
承办单位
西安交通大学
西安电子科技大学
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