288 / 2017-12-07 16:20:11
Three dimensional integration of GaN-HEMT-based DC-DC converter using planar inductor as a substrate
three dimensional integration,Finite Element Analysis,gallium ntride,synchronous buck converter
终稿
Zhiyuan Qi / Xi’an Jiaotong University
Zhizhao Niu / Xi'an Jiaotong University
Laili Wang / Xi'an Jiaotong University
Kangping Wang / Xi'an Jiaotong University
Cheng Zhao / Xi'an Jiaotong University
Yunqing Pei / Xi'an Jiaotong University
Jianpeng Wang / Xi'an Jiaotong University
The three dimensional(3D) integration technology using planar inductor as a substrate for power converter is a promising method to improve the power density. But it introduces additional parasitic inductance, not good for the application of GaN semiconductor devices. So a conductive shield layer was introduced between the magnetic substrate and GaN-based 12V/3.3V synchronous buck converter circuit to reduce loop inductance. Then the effect of shield layer thickness, insulator thickness and inductor current on parasitic inductance was investigated. And the influence of different parasitic inductance caused by different integrating structures on voltage overshoot across switches and switches’ power loss was analyzed by simulation. The results show that 3D integrated split-capacitor layout with shied layer can realize the parasitic loop inductance of 0.27nH when inductor current is 8A, which is much smaller than 1nH of the conventional structure. Heat distribution of 3D integrated structure of split-capacitor layout with shield was obtained by multi-physics coupling simulation, showing acceptable operating temperature. At last, prototypes for experiment were built to demonstrate the feasibility of 3D integrated structure using planar inductor as a substrate for power converter.
重要日期
  • 会议日期

    05月17日

    2018

    05月19日

    2018

  • 12月08日 2017

    摘要截稿日期

  • 01月30日 2018

    摘要录用通知日期

  • 02月10日 2018

    初稿截稿日期

  • 02月10日 2018

    终稿截稿日期

  • 05月19日 2018

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
IEEE POWER ELECTRONIC SOCIETY
中国电源学会
中国半导体产业创新联盟
承办单位
西安交通大学
西安电子科技大学
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