The International Conference on Microelectronics Devices, Circuits and Systems (ICMDCS 2017) will be held at the VIT University, Vellore India from 10th to 12th August 2017. ICMDCS 2017 is organized by Department of Micro and Nanoelectronics is technically sponsored by IEEE Electronic Devices Society and technically co-sponsored by Global Foundries.
The conference covers the subject areas including: Digital IC design, Analog/RF/Mixed Signal IC design, Device Modeling and Technology, RF communication circuits, Communication Technologies, Signal, Image and Video Processing, Embedded systems, Nonlinear circuits and system. In addition to the technical papers, the conference also covers tutorials on recent advancements in the above said areas, Keynote and Plenary sessions by leading industry leaders and renowned academicians.
Authors must submit their papers using easychair (https://easychair.org/conferences/?conf=icmdcs2017) on or before 20th May 2017. All papers will be reviewed for technical content and scope by a technical program committee.
All accepted and presented papers would be submitted to digitally archived through IEEE Xplore and indexed in Scopus. (IEEE Xplore Catalog Number: CFP17L10-ART, ISBN: 978-1-5386-1716-8).
Standard IEEE conference templates for LaTeX and Microsoft Word formats can be obtained from: http://www.ieee.org/conferences_events/conferences/publishing/templates.html. The page limits are SIX pages for regular papers and THREE pages for short papers. Submitted papers must be unpublished and not currently under review for any other publication. Authors of accepted papers must sign an IEEE copyright release form and also present their paper at the conference to be included in IEEE Xplore. If you have any questions regarding the submission of manuscripts, please contact the organizer through email: icmdcs2017@gmail.com
Manuscripts can be submitted under the wide ranges of fields mentioned below but are not limited to these topics.
Logic and physical synthesis, physical design, timing and signal integrity, power integrity, design for Manufacturability, design for yield, design challenges for advanced technology nodes, low-power design, power-aware and energy-efficient design, thermal management, battery-aware design, energy harvesting, CAD Tools, Verification methodologies, DFT, fault modeling and simulation, ATPG, BIST, board-level and system-level test, memory test
Design of analog, mixed-signal, and RF IP, high-speed wired and wireless communication interfaces, low-power analog and RF, memory design, standard cell design
Logic and Memory devices: Beyond CMOS devices. Fundamental understanding of non-volatile memory cells; Two-terminal selection devices for memory arrays; Revolutionary SRAM and DRAM replacement solutions;Photovoltaics Nano-electro-mechanical Systems and Sensors; Characterization and control of PV systems, Nano/bio-sensing and robots, Nano materials for NEMS, Nano fluidics. Optoelectronics, Photonics and Compound Semiconductor Devices: Synthesis and characterization of carbon-based optical materials, 2-D materials beyond graphene, Linear and nonlinear optical spectroscopy of carbon-based and other 1-D and 2-D materials, Electronic and transport properties of ultrathin carbon films, Application of nanocarbon materials for lasing, Nanocarbon-based solar cells, Growth and related technologies, High-frequency and high-power devices, GaN and related semiconductors, Oxide semiconductors, Organic semiconductors and flexible materials.
System-level design methodologies, processor and memory design, multicore systems, GPU design, on-chip communication architectures and networks-on-chip, performance analysis, defect-tolerant architectures, machine learning). : Hardware/Software co-design, embedded SoC, embedded multi-core systems, board-level hardware, hardware platforms for Internet-of-Things (IoT) devices,Reconfigurable computing, FPGA architecture and FPGA circuit design, CAD for FPGA, FPGA prototyping, FPGA-based accelerators for cloud servers,Wireless sensor networks, low-power wireless systems, wireless protocols, wireless power delivery. Communication Technologies. Networking. IoT. Big Data Analytics. Signal, Image and Video Processing Systems. Security Systems. Bio-signal processings.
and other relevant areas....
08月10日
2017
08月12日
2017
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