活动简介

Embedded systems have an increasing importance in our everyday lives. The growing complexity of embedded systems and the emerging trend to interconnections between them lead to new challenges. Intelligent solutions are necessary to overcome these challenges and to provide reliable and secure systems to the customer under a strict time and financial budget.

WISES 2017 is a platform for presentation of innovative approaches that provide intelligent solutions in embedded systems. The objective of this workshop is to present mature approaches and to provide a forum for the exchange and discussion of ideas, and thus, the sharing of experiences among researchers, practitioners, and application developers both from industry and academia. Original papers addressing both theoretical and practical aspects of embedded systems are solicited. Papers describing prototype implementations and deployments of embedded systems are particularly welcome. In order to provide young researchers a forum to exchange their ideas WISES 2017 will include a special session for PhD-Students.

The working language of the conference is English. Prospective authors are invited to submit new original research papers of 4-8 pages (2 columns IEEE format). Submissions will only be accepted electronically easychair in PDF format All submitted papers will be peer-reviewed. Accepted papers will be published in printed proceedings with ISBN and in IEEE Xplore (pending quality check by IEEE). Selected papers will be invited to publish an improved version in a special issue of the EURASIP Journal on Embedded Systems (pending approval).

征稿信息

重要日期

2017-04-30
初稿截稿日期

征稿范围

Topics of interest include, but are not limited to:

  • Embedded Systems Architecture

Multicore SoC (e.g. homogeneous, heterogeneous MPSoC) ‐ Memory systems and optimization in embedded systems ‐ On‐chip buses and point‐to‐point networks ‐ Application‐specific (e.g. ASIPs, hardware accelerators)

  • Runtime Reconfigurable Computing

Architectures and tools – FPGAs for embedded  applications

  • Software for single or multicore embedded systems

Applications and systems software (e.g. drivers, communication libraries) ‐ Real‐time operating systems and middleware in embedded systems

  • Prototype platforms, applications and case studies 

Next generation networking and mobile/wireless technology ‐ Sensor networks and related hardware/software platforms ‐ Embedded systems with ambient intelligence and pervasiveness

  • Tools and methodologies for analysis, exploration and validation

Cost‐efficient and power‐aware embedded system design ‐ Fault tolerance, reliability and security in embedded systems ‐ Real‐time embedded systems - Debugging and profiling techniques and tools

  • Emerging Technologies and Applications

Reconfigurable computing, Evolvable hardware, Energy harvesting and storage. ICT for health and ageing well, inclusion and governance, self-organizing embedded systems.

  • Automotive Applications

System‐level design of HW/SW in‐vehicle architectures, Tools to address the requirements for automotive electronic design, integration of different communication buses (like CAN, MOST, FlexRay and Ethernet), Security, Safety critical, driver assistance and comfort related applications, Electro-mobility, Battery management systems,  Integration Electric Vehicle in smart energy grids.

留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    06月12日

    2017

    06月13日

    2017

  • 04月30日 2017

    初稿截稿日期

  • 06月13日 2017

    注册截止日期

主办单位
IEEE Germany Section
IEEE Germany Section IE/IA/PEL Joint Chapter
历届会议
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询