活动简介
It is our pleasure to announce that the IMAPS Nordic Conference on Microelectronics Packaging (NordPac) will be held 18th – 20th June 2017 in Gothenburg, Sweden. This is first time that IMAPS Nordic Chapter and IEEE CPMT Nordic Chapter jointly organise this event. The event brings together both academics as well as industry leaders to discuss and debate the state-of-the-art and future trends in microelectronics components, packaging, integration and manufacturing technologies. NordPac provides a perfect opportunity to hear the latest news and developments in the field. So mark the dates in your calendar today!
征稿信息
征稿范围
The abstract submission has been closed and the authors have been notified. Nordpac has received 38 abstracts within the various topcis below.
- Materials and Processes for Packaging
- Advanced Packaging and System Integration
- Interconnect Technology
- Thermal Management
- 1D, 2D, 2.5D and 3D integration technology
- Signal Integrity
- Emerging Technology
- Reliability, Material and Process Modelling
- Reliability Testing and Characterization
- Design for Recycling in Electronics Packaging
- Applications Life Cycle Assessment
全部留言
重要日期
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会议日期
06月18日
2017
至06月20日
2017
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06月20日 2017
注册截止日期
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