Signal Integrity Design for Air-filled Interconnect in 5G/6G Communication Network
编号:8 访问权限:仅限参会人 更新:2023-10-11 13:06:11 浏览:92次 特邀报告

报告开始:2023年10月31日 12:30(Asia/Shanghai)

报告时间:60min

所在会场:[P] The FIRST Interdisciplinary Conference 2023 [P4] Plenary Session 4

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摘要
Driven by the evolution of commercial applications and user experience, the demand of 5G/6G high-speed communication is increasing rapidly in recent years. Data transmission in millimeter-wave (mm-wave) and subterahertz (sub-THz) is gaining interest to provide widely available bandwidth and meet the requirement for higher capacity and lower latency. Interconnects with low power loss and good signal integrity are necessary for 5G/6G communication network. Among all competitors, air-filled interconnect may play an essential role for 5G/6G applications. Air-filled substrate integrated waveguide (AFSIW) offers an extremely low-loss solution for inner-board transmission. And air-filled dielectric waveguide (AFDW) provides a low-loss solution for intra-device transmission with short-to-medium distance. Moreover, highly-integrated multi-lane AFDWs are expected to achieve communication with even higher throughput. However, the interference issue is critical. To enhance signal integrity of multi-lane AFDW, photonic crystal fence (PCF) can be applied compactly with AFDWs and provide significant crosstalk reduction. These techniques take a key step for the technical race in the 5G/6G high-speed communication in the near future.
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报告人
Tzong Lin WU
National Taiwan University

IEEE Fellow; Associate Dean and Distinguished Professor at Department of Electrical Engineering & Graduate Institute of Communication Engineering, National Taiwan University (NTU)

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重要日期
  • 会议日期

    10月30日

    2023

    10月31日

    2023

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