The increasing power density and miniaturization generated much heat in electronic devices and electric equipment, and thus seeking high efficiency thermal management materials becomes more urgent and important for ensuring their reliability. Thermally conductive polymer composites have strong potential as thermal management materials because of their ease of processing, lightweight and low cost. In this presentation, the speaker will present the recent advances in thermally conductive polymer/boron nitride nanocomposites. Interface is an important factor in determining the composite property, while most of attention was paid on the interface between the polymer matrix and the filler. In this talk, however, emphasis will be given to how to tailor the filler/filler interface for thermally conductive polymer nanocomposites. Some applications of the thermally conductive polymer/boron nitride nanocomposites will be introduced.