639 / 2019-03-05 15:55:34

Study on nozzle guide vane subject to thermal shock using finite element method

Transient Thermal; Transient Thermal-fluid-solid Coupling; Thermal stress; Thermal damage

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Two forms of nozzle guide vane model are established, which are gas film cooling vane (FCV) and hollow vane (HV). Transient one-way thermal-fluid-solid coupling method (TOTFSCM) was used to run the numerical simulation of the thermal shock process, and the instantaneous temperature and stress changes of the two kinds of vane in the start-up phase were analyzed and compared. The result shows that the FCV can reduce the thermal stress and temperature on the surface. But there is larger stress concentration in the cooling holes of the FCV, and it will be lager with the rising of temperature. This explains why the air-cooled blade on the cooling hole prone to fracture. This article has a reference value in the analysis of the thermal damage mechanism of the turbine guide vane.